Abstract Flexible copper clad laminate (FCCL) is the key base material for versatile applications such as mobile devices, wearable electronics, and point-of-care biosensors. Development of adhesiveless FCCL is urgent to achieve a thinner, lighter, and thermally stable substrate for advanced high-frequency (5G) applications. In this study, a co-silanization method is proposed to functionalize the polyimide (PI) surface for efficient metal immobilization and adhesion enhancement. The co-silanization treatment features the establishment of a barricade-like network structure by the assistant organosilane, trimethoxyphenylsilane (TMPS), to generate spatial confinement effect (SCE) to effectively control the positioning and grafting orientation of the functional organosilane, 3-[2-(2-aminoethylamino)ethylamino]propyl-trimethoxysilane (ETAS), on the PI film. Benefitting from the effective positioning and grafting, the two types of organosilanes form a composite well-organized molecular nanolayer which is in possession of strong tethering ability for metal attachment and immobilization. Compared to the mono-silanization system with ETAS only (0.652 kgf/cm), the co-silanization treatment (ETAS + TMPS) remarkably enhances the peel strength of the deposited metal layer on PI by 53% (~1 kgf/cm).

中文翻译：

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用于增强异质结附着力的组织良好的有机硅烷复合材料

摘要 柔性覆铜板 (FCCL) 是移动设备、可穿戴电子产品和即时生物传感器等多功能应用的关键基础材料。开发无粘合剂 FCCL 迫切需要为高级高频 (5G) 应用实现更薄、更轻且热稳定的基板。在这项研究中，提出了一种共硅烷化方法来功能化聚酰亚胺 (PI) 表面，以实现有效的金属固定和粘附增强。共硅烷化处理的特点是通过辅助有机硅烷三甲氧基苯基硅烷 (TMPS) 建立路障状网络结构，产生空间限制效应 (SCE) 以有效控制功能性有机硅烷的定位和接枝取向，3-[2 -(2-氨基乙基氨基)乙基氨基]丙基-三甲氧基硅烷(ETAS)，在 PI 胶片上。得益于有效的定位和接枝，两种有机硅烷形成了一个复合的、组织良好的分子纳米层，对金属附着和固定具有很强的束缚能力。与仅使用 ETAS 的单硅烷化系统 (0.652 kgf/cm) 相比，共硅烷化处理 (ETAS + TMPS) 显着提高了 PI 上沉积金属层的剥离强度 53% (~1 kgf/cm)。