Abstract The effect of ultraviolet (UV) surface modification on a polyimide (PI) substrate was investigated for the intense pulsed light (IPL) sintering of Cu nanoparticle (NP)/microparticle (MP)-ink. The UV surface-modification conditions, such as the wavelength range (UVA, UVB, and UVC) and irradiation intensity, were optimized to enhance the IPL sintering characteristic. To measure the surface roughness of the UV-modified PI substrate, atomic force microscopy was conducted. X-ray photoelectron spectroscopy and contact-angle analysis were performed for measuring the change in the surface functional groups of the PI substrate. The IPL irradiation conditions (pulse power and pulse duration) were optimized to obtain a high electrical conductivity and high adhesion strength. Scanning electron microscopy was performed to analyze the microstructure of the IPL-sintered Cu NP/MP-ink. Laser flash analysis was used to measure the thermal conductivity of the sintered Cu NP/MP-ink on the PI substrate. Additionally, in situ temperature monitoring was conducted to monitor the IPL sintering process in real time. According to the results, the optimal IPL-sintered Cu NP/MP-ink film with UVC modification exhibited a low resistivity of 5.94 μΩ cm and a high adhesion strength level of 5B.

中文翻译：

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在聚酰亚胺基板上使用紫外表面改性增强铜纳米颗粒/微粒墨水的强脉冲光烧结特性

摘要 研究了紫外 (UV) 表面改性对聚酰亚胺 (PI) 基材的影响，用于强脉冲光 (IPL) 烧结 Cu 纳米颗粒 (NP)/微粒 (MP) 墨水。优化了 UV 表面改性条件，例如波长范围（UVA、UVB 和 UVC）和照射强度，以增强 IPL 烧结特性。为了测量 UV 改性 PI 基材的表面粗糙度，进行了原子力显微镜检查。进行 X 射线光电子能谱和接触角分析以测量 PI 基底表面官能团的变化。优化 IPL 照射条件（脉冲功率和脉冲持续时间）以获得高导电性和高粘附强度。使用扫描电子显微镜分析 IPL 烧结的 Cu NP/MP 墨水的微观结构。激光闪光分析用于测量 PI 基材上烧结的 Cu NP/MP 墨水的热导率。此外，还进行了原位温度监测以实时监测 IPL 烧结过程。根据结果​​，具有UVC改性的最佳IPL烧结Cu NP/MP-油墨膜表现出5.94 μΩ cm的低电阻率和5B的高粘附强度水平。