With the advent of next-generation Wi-Fi technology, the demand for shrinking Wi-Fi front end module (FEM) product size is voracious. In this letter, a novel package technique called hot-via chip-scale package (HVCSP) is proposed. HVCSP has benefits such as ultrasmall package size, low cost, bump-free, substrate-free, and outstanding RF performance. In this letter, a 5-GHz Wi-Fi FEM using GaAs-based Bi-HEMT technology and HVCSP is also demonstrated. Due to the wire and lead frame-free structure, the package size can be further reduced by over 40% compared to the traditional QFN package. By employing a hot-via transformer structure, the measurement loss from chip to package is below -0.5 dB from 0 to 67 GHz. With these advantages, HVCSP is suitable for Wi-Fi FEM applications perfectly.

中文翻译：

---

适用于 Wi-Fi FEM 应用的超紧凑、低成本和高性能射频封装技术


随着下一代 Wi-Fi 技术的出现，对缩小 Wi-Fi 前端模块 (FEM) 产品尺寸的需求非常旺盛。在这封信中，提出了一种称为热通孔芯片级封装（HVCSP）的新型封装技术。 HVCSP具有超小封装尺寸、低成本、无凸块、无基板以及出色的射频性能等优点。在这封信中，还演示了使用基于 GaAs 的 Bi-HEMT 技术和 HVCSP 的 5 GHz Wi-Fi FEM。由于采用无引线和无引线框架结构，与传统 QFN 封装相比，封装尺寸可进一步减小 40% 以上。通过采用热通孔变压器结构，从芯片到封装的测量损耗在 0 至 67 GHz 范围内低于 -0.5 dB。凭借这些优势，HVCSP 非常适合 Wi-Fi FEM 应用。