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An Ultracompact, Low-Cost, and High-Performance RF Package Technique for Wi-Fi FEM Applications
IEEE Microwave and Wireless Components Letters ( IF 2.374 ) Pub Date : 2020-02-19 , DOI: 10.1109/lmwc.2020.2971389
Jui-Chieh Chiu; Shao-Cheng Hsiao; Po-Kie Tseng; You-Cheng Lai; Chih-Wen Huang

With the advent of next-generation Wi-Fi technology, the demand for shrinking Wi-Fi front end module (FEM) product size is voracious. In this letter, a novel package technique called hot-via chip-scale package (HVCSP) is proposed. HVCSP has benefits such as ultrasmall package size, low cost, bump-free, substrate-free, and outstanding RF performance. In this letter, a 5-GHz Wi-Fi FEM using GaAs-based Bi-HEMT technology and HVCSP is also demonstrated. Due to the wire and lead frame-free structure, the package size can be further reduced by over 40% compared to the traditional QFN package. By employing a hot-via transformer structure, the measurement loss from chip to package is below −0.5 dB from 0 to 67 GHz. With these advantages, HVCSP is suitable for Wi-Fi FEM applications perfectly.
更新日期:2020-03-16

 

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