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Successes and Challenges Associated with Solution Processing of Kesterite Cu2ZnSnS4 Solar Cells on Titanium Substrates
ACS Applied Energy Materials ( IF 5.4 ) Pub Date : 2020-03-13 00:00:00 , DOI: 10.1021/acsaem.0c00292
Zhengfei Wei 1 , Thomas O. Dunlop 1 , Peter J. Heard 2 , Cecile Charbonneau 1 , David A. Worsley 1 , Trystan M. Watson 1
Affiliation  

Roll-to-roll (R2R) processing of solution-based Cu2ZnSn(S,Se)4 (CZT(S,Se)) solar cells on the flexible metal foil is an attractive way to achieve cost-effective manufacturing of photovoltaics. In this work, we report the first successful fabrication of solution-processed CZTS devices on a variety of titanium substrates with up to 2.88% power conversion efficiency (PCE) collected on flexible 75 μm Ti foil. A comparative study of device performance and properties is presented aiming to address the key processing challenges. First, we show that a rapid transfer of heat through the titanium substrates is responsible for the accelerated crystallization of kesterite films characterized with small grain size, a high density of grain boundaries, and numerous pore sites near the Mo/CZTS interface, which affect charge transport and enhance recombination in devices. Following this, we demonstrate the occurrence of metal ion diffusion induced by the high-temperature treatment required for the sulfurization of the CZTS stack: Ti4+ ions are observed to migrate upward to the Mo/CZTS interface while Cu1+ and Zn2+ ions diffuse through the Mo layer into the Ti substrate. Finally, residual stress data confirm the good adhesion of stacked materials throughout the sequential solution process. These findings are evidenced by combining electron imaging observations, elemental depth profiles generated by secondary ion mass spectrometry, and X-ray residual stress analysis of the Ti substrate.

中文翻译:

钛基衬底上的Kesterite Cu 2 ZnSnS 4太阳能电池固溶处理的成功与挑战

溶液基Cu 2 ZnSn(S,Se)4的卷对卷(R2R)处理柔性金属箔上的(CZT(S,Se))太阳能电池是实现具有成本效益的光伏制造的一种有吸引力的方式。在这项工作中,我们报告了在多种钛基板上成功进行溶液加工的CZTS器件的首次成功制造,其在75μm的Ti箔片上收集的功率转换效率(PCE)高达2.88%。针对器件的性能和特性进行了比较研究,旨在解决关键的加工挑战。首先,我们表明,热量快速通过钛基体传递是导致特征尺寸小的晶粒,高的晶界密度以及Mo / CZTS界面附近的许多孔位的特征的斑晶石膜加速结晶的原因。运输并增强设备中的重组。按照此,观察到4+离子向上迁移到Mo / CZTS界面,而Cu 1+和Zn 2+离子通过Mo层扩散到Ti衬底中。最后,残余应力数据证实了整个顺序溶液过程中堆叠材料的良好粘合性。这些发现是通过结合电子成像观察,二次离子质谱法生成的元素深度分布以及Ti基板的X射线残余应力分析而得到证明的。
更新日期:2020-03-13
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