Linear viscoelastic characterization of electrically conductive adhesives used as interconnect in photovoltaic modules,Progress in Photovoltaics

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Linear viscoelastic characterization of electrically conductive adhesives used as interconnect in photovoltaic modules
Progress in Photovoltaics ( IF 8.0 ) Pub Date : 2020-03-11 , DOI: 10.1002/pip.3257
Martin Springer ₁ , Nick Bosco ₁

Affiliation

Electrically conductive adhesives (ECAs) are incorporated into recent designs of photovoltaic (PV) modules and replace the traditional metallic solders as interconnects. This transition depicts a significant material change, and a proper understanding of the interconnects' mechanical response has not yet been established. However, such an understanding is necessary to (a) identify the driving forces for module degradation and failure, (b) allow for module design optimization, and (c) enable accurate lifetime predictions. This study summarizes the framework for the mechanical materials characterization and modeling of ECAs for PV applications. Only high‐fidelity material models are able to capture the rate and temperature dependency of the ECA interconnect and allow for accurate modeling of the materials response. A linear viscoelastic representation is found to describe the mechanical response of the ECAs sufficiently well. The effects of curing conditions and environmental exposure are investigated, and material models for a variety of ECAs are reported and prepared for the use in numerical simulations. A finite element simulation of a generic submodel of a shingled cell module is used to highlight the need for high‐fidelity material models and demonstrates the error made in the predicted stress states by using less sophisticated models.

中文翻译：

用作光伏模块互连的导电胶的线性粘弹性表征

导电胶（ECA）已被纳入光伏（PV）模块的最新设计中，并取代了传统的金属焊料作为互连件。这种过渡描绘了重大的材料变化，并且尚未建立对互连件机械响应的正确理解。但是，这种理解对于（a）识别模块退化和故障的驱动力，（b）允许模块设计优化以及（c）能够进行准确的寿命预测是必要的。这项研究总结了用于光伏应用的ECA的机械材料表征和建模的框架。只有高保真材料模型才能捕获ECA互连的速率和温度依赖性，并允许对材料响应进行精确建模。发现线性粘弹性表示可以很好地描述ECA的机械响应。研究了固化条件和环境暴露的影响，并报告了各种ECA的材料模型，并准备将其用于数值模拟。对带格单元模块的通用子模型的有限元模拟用于强调对高保真材料模型的需求，并通过使用较不复杂的模型来演示预测应力状态下的误差。

更新日期：2020-03-11

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