Abstract The miniaturization, integration and compatibilization of electronic devices dictate the need for efficient thermal management to prevent heat accumulation, which may reduce the operation speed and shorten their life time. Addressing this challenge requires the development of novel polymer-based composite materials with enhanced thermal conductivity. Here, we report a compression-based (25–250 bars) approach for the preparation of polymer composites loaded with carbon-based hybrid fillers, i.e., graphene nanoplatelets and graphite flakes. The carbon-based fillers contribute significantly to the thermal conductivity of the composite while boron nitride nanoparticles inhibit the electrical conductivity to avoid short circuits. An optimal thermal conductivity of 27.5 W (m K)−1 is obtained for the compressed system (measured under atmospheric pressure) for epoxy polymer loaded with 30 wt% graphene nanoplatelets and 40 wt% graphite flakes compared to 0.2 W (m K)−1 of the neat thermoset polymer.

中文翻译：

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碳载聚合物复合材料的压缩增强热导率

摘要 电子设备的小型化、集成化和兼容性要求需要有效的热管理来防止热量积聚，这可能会降低运行速度并缩短其使用寿命。解决这一挑战需要开发具有增强导热性的新型聚合物基复合材料。在这里，我们报告了一种基于压缩（25-250 巴）的方法，用于制备装载有碳基混合填料的聚合物复合材料，即石墨烯纳米片和石墨薄片。碳基填料对复合材料的导热性有显着贡献，而氮化硼纳米颗粒抑制导电性以避免短路。最佳导热系数为 27。