Abstract

This paper presents for the first time implementation of zig–zag and solenoidal on-chip inductors in standard and cost effective SOI-MUMPs fabrication process. The solenoidal inductor offers high Q-factor and inductance as compared to planar zig–zag inductor. Bonding wires are used to construct the top conductor loop of the solenoidal inductor. The inductors are also characterized at elevated temperature for performance investigation in harsh environment. The mechanical resonance frequency of the inductors are characterized using the Finite element software COMSOL. The inductors are characterized using a vector network analyzer from 60 MHz to 3 GHz, and the results of both inductors are compared. The total size of the device is 2 × 0.7 mm².

中文翻译：

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用于RF MEMS IC的SOI-MUMP中制造的片上集成电感器的研究

摘要

本文首次介绍了在标准且经济高效的SOI-MUMPs制造过程中采用之字形和螺线管片上电感器的方法。与平面之字形电感器相比，螺线管电感器具有更高的Q因子和电感。键合线用于构造螺线管感应器的顶部导体回路。电感器还具有高温特性，可用于恶劣环境下的性能研究。电感器的机械共振频率使用有限元软件COMSOL进行表征。使用矢量网络分析仪在60 MHz至3 GHz范围内对电感进行表征，并比较两个电感的结果。装置的总尺寸为2×0.7 mm ²。