Abstract This study describes the application of a magnetic abrasive finishing (MAF) process to yield a fine finish on planar workpiece (SS304). The grinding tool is a flexible abrasive brush using diamond particles embedded in a spherical iron matrix. This bonded type of spherical MAPs was developed via an atomization technology to solve the problem that hard particles were easily thrown from the magnetic field at high rotational speed. Theoretical model of the material removal was composed of the mechanical properties of work material and four applied process parameters such as working gap, rotational speed of magnetic pole, feed rate of workpiece, and size of magnetic abrasive powder (MAP). The magnitude and distribution of generated magnetic flux was simulated by finite element analysis to evaluate the normal pressure of MAP. The single factor experiment was conduct to analyze the relationship between surface roughness reduction and material removal. Scanning electron microscopy was used to understand the effect of different abrasive material on the finished surface of workpiece. Under the same optimum processing condition, diamond MAPs produced a better surface roughness and more material removal than CBN MAPs and alumina MAPs did. The established theoretical model brought out that high material removal corresponds to a fine surface roughness in the MAF process with atomized spherical MAPs.

中文翻译：

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球形磁性磨料磨料磨削过程中材料去除的模拟

摘要 本研究描述了应用磁性研磨精加工 (MAF) 工艺对平面工件 (SS304) 进行精加工。研磨工具是一种柔性磨刷，使用嵌入球形铁基体中的金刚石颗粒。这种键合型球形MAPs是通过雾化技术开发的，以解决高转速下容易从磁场中抛出硬质颗粒的问题。材料去除的理论模型由工作材料的机械性能和四个应用的工艺参数组成，例如工作间隙、磁极转速、工件进给速度和磁性磨料粉 (MAP) 的尺寸。通过有限元分析模拟产生的磁通量的大小和分布，以评估MAP的法向压力。进行单因素试验以分析表面粗糙度降低与材料去除之间的关系。扫描电子显微镜用于了解不同磨料对工件精加工表面的影响。在相同的最佳加工条件下，金刚石 MAP 比 CBN MAP 和氧化铝 MAP 产生更好的表面粗糙度和更多的材料去除。建立的理论模型表明，在具有雾化球形 MAP 的 MAF 工艺中，高材料去除率对应于精细的表面粗糙度。在相同的最佳加工条件下，金刚石 MAP 比 CBN MAP 和氧化铝 MAP 产生更好的表面粗糙度和更多的材料去除。建立的理论模型表明，在具有雾化球形 MAP 的 MAF 工艺中，高材料去除率对应于精细的表面粗糙度。在相同的最佳加工条件下，金刚石 MAP 比 CBN MAP 和氧化铝 MAP 产生更好的表面粗糙度和更多的材料去除。建立的理论模型表明，在具有雾化球形 MAP 的 MAF 工艺中，高材料去除率对应于精细的表面粗糙度。