Copper foil is a key material of printed circuit boards and plays an important role in the conductance of electric circuits and interconnection of electronic components. When high-frequency signals were transmitted in rough copper foil wires, the conductor resistance, wire loss, and signal loss increased because of the skin effect. To reduce the negative influence of the skin effect and improve the quality of the copper foil, a laser shock flattening (LSF) method was proposed to manufacture profile-free copper foil with high performance. It was concluded that the better flattening effect for large-area profile-free copper foil could be achieved at a pulse energy of 0.25 J and an overlap rate of 25%, and its surface roughness decreased by 67.0% from 52.1 nm to 17.2 nm. Subsequently, to determine the mechanism for the flattened deformation of copper foil induced by LSF, the microstructures of the copper foil before and after flattening were characterised using transmission electron microscopy. A higher dislocation density and a few deformation twins were found in the profile-free copper foil. Ultimately, nano-indentation, micro-tensile, and electrochemical corrosion tests indicated that the mechanical properties and corrosion resistance of the copper foil were significantly improved by LSF. This technique would enable the successful fabrication of large-area profile-free copper foil with high performance for the emerging applications of ultra-high-frequency signal communication and printed circuit board manufacture.

铜箔是印刷电路板的关键材料，并且在电路的导电性和电子元件的互连中起着重要的作用。在粗铜箔电线中传输高频信号时，由于集肤效应，导体电阻，导线损耗和信号损耗会增加。为了减少趋肤效应的负面影响并提高铜箔的质量，提出了一种采用激光冲击平坦化（LSF）的方法来制造高性能的无轮廓铜箔。结论是：在0.25 J的脉冲能量和25％的重叠率下，大面积无轮廓铜箔可以获得更好的扁平化效果，并且其表面粗糙度从52.1 nm减小到17.2 nm，降低了67.0％。后来，为了确定由LSF引起的铜箔扁平变形的机理，使用透射电子显微镜表征了扁平前后铜箔的微观结构。在无轮廓的铜箔中发现较高的位错密度和少量的变形孪晶。最终，纳米压痕，微拉伸和电化学腐蚀测试表明，LSF显着改善了铜箔的机械性能和耐腐蚀性。这项技术将能够成功地制造出高性能的大面积无轮廓铜箔，以用于超高频信号通信和印刷电路板制造的新兴应用。利用透射电子显微镜对扁平化前后铜箔的微观结构进行了表征。在无轮廓的铜箔中发现较高的位错密度和少量的变形孪晶。最终，纳米压痕，微拉伸和电化学腐蚀测试表明，LSF显着改善了铜箔的机械性能和耐腐蚀性。这项技术将能够成功地制造出高性能的大面积无轮廓铜箔，以用于超高频信号通信和印刷电路板制造的新兴应用。利用透射电子显微镜对扁平化前后铜箔的微观结构进行了表征。在无轮廓的铜箔中发现较高的位错密度和少量的变形孪晶。最终，纳米压痕，微拉伸和电化学腐蚀测试表明，LSF显着改善了铜箔的机械性能和耐腐蚀性。这项技术将能够成功地制造出高性能的大面积无轮廓铜箔，以用于超高频信号通信和印刷电路板制造的新兴应用。电化学腐蚀试验表明，LSF可显着提高铜箔的力学性能和耐蚀性。这项技术将能够成功制造具有高性能的大面积无轮廓铜箔，以用于超高频信号通信和印刷电路板制造的新兴应用。电化学腐蚀试验表明，LSF可显着提高铜箔的力学性能和耐蚀性。这项技术将能够成功地制造出高性能的大面积无轮廓铜箔，以用于超高频信号通信和印刷电路板制造的新兴应用。