Thermal interface materials (TIMs) are essential components to deplete the accumulated heat with efficient thermal management in the majority of power electronic systems such that the interfacial thermal resistance (ITR) should be significantly reduced. A reduced percolation threshold of hybrid fillers of ball-milled exfoliated graphite nanoplatelets and AgNWs are used for enhanced thermal interface materials via the assembly of high-quality ball-milled exfoliated graphite nanoplatelets (BMEGN) and AgNWs on a flexible Polydimethylsiloxane (PDMS) substrate. BMEGN modified surface with increased specific area and reduced percolation interface, together with the generation of effective 3D thermal conductive pathways between the 2D graphite and 1D AgNWs, which was experimentally measured to possess the significant improvement in thermal conductivity. The proposed method of thermally conductive film of AgNWs at the loading of 2.0 mg/mL can dramatically increase the in-plane thermal conductivity (K_//) to 29.2 W/mK, while the through-plane thermal conductivity (K_┴) shows the value of 4.94 W/mK by using the reduced percolation threshold. Anisotropy reaches up to K_///K_┴ = 5.9 with the proposed percolation, which is much larger than filler only BMEGN, indicating that the effective thermal conductive path (TCP) can be networked on a PDMS polymeric to thermally dissipate high power electronics with enhanced heat management capability. Both CPU and IGBT tests of the proposed TIMs with fillers of AgNWs loading 2.0 mg/mL can effectively minimize temperature rise to ∼16 °C and ∼17 °C as favorably compared with thermal grease alone. Furthermore, transmission electron microscopy (TEM), scanning electron microscopy (SEM), Raman, X-ray diffraction (XRD) and thermogravimetric analysis (TGA) were used for surface morphology, microstructure evolution, disorder evaluation, phase analysis and thermal stability of the composite material.

在大多数电力电子系统中，热界面材料（TIM）是通过有效的热管理来消耗累积热量的必不可少的组件，因此应显着降低界面热阻（ITR）。通过在柔性聚二甲基硅氧烷（PDMS）基板上组装高质量的球磨脱落石墨纳米片（BMEGN）和AgNW，可以将球磨脱落石墨纳米片和AgNW的混合填料的降低的渗漏阈值用于增强的热界面材料。BMEGN修饰的表面具有增加的比表面积和减少的渗流界面，以及在2D石墨和1D AgNWs之间生成有效的3D导热途径的过程，通过实验测量该途径具有显着的导热性改善。_//）降低到29.2 W / mK，而通过降低的渗漏阈值，贯穿平面的热导率（_K┴）显示为4.94 W / mK的值。各向异性高达K _// / _K┴ 所建议的渗流系数= 5.9，远大于仅填料的BMEGN，表明有效的导热路径（TCP）可以在聚合物PDMS上联网，从而以增强的热管理能力散热高功率电子器件。与单独使用导热硅脂相比，使用载有2.0 mg / mL AgNWs填料的拟议TIM进行的CPU和IGBT测试均可有效地将温度升高降至约16°C和约17°C。此外，使用透射电子显微镜（TEM），扫描电子显微镜（SEM），拉曼光谱，X射线衍射（XRD）和热重分析（TGA）进行表面形貌，微观结构演变，无序评估，相分析和热稳定性。复合材料。