Directly Spin Coating a Low‐Viscosity Organic Semiconductor Solution onto Hydrophobic Surfaces: Toward High‐Performance Solution‐Processable Organic Transistors,Advanced Materials Interfaces

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Directly Spin Coating a Low‐Viscosity Organic Semiconductor Solution onto Hydrophobic Surfaces: Toward High‐Performance Solution‐Processable Organic Transistors
Advanced Materials Interfaces ( IF 4.3 ) Pub Date : 2020-02-25 , DOI: 10.1002/admi.201901950
Shuya Wang ₁ , Xiaoli Zhao ₁ , Yanhong Tong ₁ , Qingxin Tang ₁ , Yichun Liu ₁

Affiliation

Solution‐processable organic thin‐film transistors (OTFTs) have attracted considerable attention owing to their low cost, low‐temperature preparation, and compatibility with flexible substrates. Spin‐coating is the simplest and most common method for manufacturing large‐area OTFTs; it can be challenging, however, to spin‐coat high‐quality, uniform organic semiconductor films onto hydrophobic surfaces. The use of such surfaces is vital for improving device performance. In this work, through theoretical calculation of the spreading parameter and wetting envelope, the wetting behavior of organic semiconductor solutions on hydrophobic dielectrics is quantitatively analyzed. Based on the theoretical findings, organic‐semiconductor‐solution surface tension is systematically adjusted to solve the common wettability issues. The crystallinity of the wettable organic semiconductor film is also significantly improved by a post‐annealing performed at even lower temperature. As a result, fabricated 6,13‐bis(triisopropylsilylethynyl)‐pentacene OTFTs show excellent electrical characteristics, with mobility and current on/off ratios up to 1.66 cm² V⁻¹ s⁻¹ and 7 × 10⁹, respectively. This work provides general guidance for solving wettability issues, that can lead to the development of new‐generation, high‐performance, solution‐processable, organic electronic devices.

中文翻译：

将低粘度有机半导体溶液直接旋涂到疏水性表面上：迈向高性能溶液可加工的有机晶体管

可溶液处理的有机薄膜晶体管（OTFT）由于其低成本，低温制备以及与柔性基板的兼容性而备受关注。旋涂是制造大面积OTFT的最简单，最常用的方法。然而，将高质量，均匀的有机半导体薄膜旋涂到疏水表面上可能是一个挑战。使用此类表面对于提高设备性能至关重要。在这项工作中，通过理论计算扩散参数和润湿包络线，定量分析了有机半导体溶液在疏水电介质上的润湿行为。根据理论发现，有机硅溶液的表面张力经过系统调整以解决常见的润湿性问题。通过在更低温度下进行的后退火处理，可湿性有机半导体膜的结晶度也得到了显着改善。结果，制成的6,13-双（三异丙基甲硅烷基乙炔基）-并五苯OTFT显示出出色的电特性，迁移率和电流开/关比高达1.66厘米^分别为2 V ^-1 s ^-1和7×10 ⁹。这项工作为解决润湿性问题提供了一般性指导，可导致开发新一代，高性能，可溶液处理的有机电子设备。

更新日期：2020-02-25

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