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Guest Editorial: Special Section on Modeling, Design, and Application of Next-Generation Power Components
IEEE Journal of Emerging and Selected Topics in Power Electronics ( IF 4.6 ) Pub Date : 2020-02-03 , DOI: 10.1109/jestpe.2019.2957959
Laili Wang , John Shen

We Have witnessed that each generation of power devices triggered a renovation in power conversion in the past decades. Wide bandgap (WBG) power devices,as the new generation of power devices, will undoubtedly make great changes to today’s power conversion system. Actually, they are now establishing new benchmarks in various applications benefiting from their higher switching frequency,higher power density, and higher efficiency. A broad consensus has been reached that power integration technology should be employed to fully explore the potential of WBG devices.Simultaneously, the characteristics of WBG devices also create a great chance for integration. However, many issues need to be addressed on the WBG-enabled power integration road,including device modeling, gate driving techniques, device and module packaging, and application-oriented integration schemes. Magnetics and capacitors also play a key role in power integration. Their power loss, operating temperature,and integration scheme with active devices also fall in the research interests.

中文翻译:

客座社论:下一代功率组件的建模,设计和应用专区

我们已经看到,在过去的几十年中,每一代功率设备都引发了功率转换的革新。宽带隙(WBG)电源设备作为新一代电源设备,无疑将对当今的电源转换系统做出巨大的改变。实际上,受益于其更高的开关频率,更高的功率密度和更高的效率,他们现在正在各种应用中建立新的基准。人们已达成广泛共识,即应使用电源集成技术来充分挖掘WBG器件的潜力。同时,WBG器件的特性也为集成创造了巨大机会。但是,在启用WBG的电源集成道路上需要解决许多问题,包括设备建模,栅极驱动技术,设备和模块封装,和面向应用程序的集成方案。磁性和电容器在电源集成中也起着关键作用。它们的功率损耗,工作温度以及与有源器件的集成方案也符合研究兴趣。
更新日期:2020-04-22
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