Power module packaging technologies have been experiencing extensive changes as the novel silicon carbide (SiC) power devices with superior performance become commercially available. This article presents an overview of power module packaging technologies in this transition, with an emphasis on the challenges that current standard packaging face, requirements that future power module packaging needs to fulfill, and recent advances on packaging technologies. The standard power module structure, which is a widely used current practice to package SiC devices, is reviewed, and the reasons why novel packaging technologies should be developed are described in this article. The packaging challenges associated with high-speed switching, thermal management, high-temperature operation, and high-voltage isolation are explained in detail. Recent advances on technologies, which try to address the limitations of standard packaging, both in packaging elements and package structure are summarized. The trend toward novel soft-switching power converters gave rise to problems regarding package designs of unconventional module configuration. Potential applications areas, such as aerospace applications, introduce low-temperature challenges to SiC packaging. Key issues in these emerging areas are highlighted.

中文翻译：

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SiC功率模块封装技术的回顾：挑战，进步和新出现的问题

随着具有优异性能的新型碳化硅（SiC）功率器件在市场上可买到，功率模块封装技术已经发生了广泛的变化。本文概述了在此过渡中的功率模块封装技术，重点介绍了当前标准封装所面临的挑战，未来功率模块封装需要满足的要求以及封装技术的最新进展。本文回顾了标准功率模块结构，该结构是当前广泛用于封装SiC器件的实践，并在本文中介绍了开发新颖封装技术的原因。详细说明了与高速开关，热管理，高温操作和高压隔离相关的封装挑战。总结了试图解决标准包装在包装要素和包装结构方面的局限性的最新技术进展。新型软开关功率转换器的趋势引起了有关非常规模块配置的封装设计的问题。潜在的应用领域，例如航空航天应用，给SiC封装带来了低温挑战。这些新兴领域的关键问题得到了强调。给SiC封装带来了低温挑战。这些新兴领域的关键问题得到了强调。给SiC封装带来了低温挑战。这些新兴领域的关键问题得到了强调。