A host of high-voltage-capable electronic packaging approaches have emerged in recent years for usage in nextgeneration power electronics. In this article, the focus is on the challenge of managing the thermal characteristics in these cutting edge packaging options, where power densities are exceeding 25 kW/L. Utilizing wide bandgap semiconductors like SiC and GaN can help reduce the thermal inefficiencies associated with conduction losses by using high-frequency switching topologies, but even so, when considering the demand of high voltage in mobile electrified systems, heat generation is still a primary limiting factor in widespread adoption. Accordingly, the increased power density results in much higher temperatures at the device and package level, which in turn reduces the reliability of such systems, in terms of thermal breakdown or thermomechanical strains within the packages. As a result, the design of cooling systems for these electronics has emerged as a key component to successful implementation, and effective thermal management schemes must be closely integrated with the electronic packaging for maximum benefit. This review looks at various thermal management approaches that have been demonstrated in electronic systems, with a specific emphasis on the challenges and needs for next-generation high-voltage power electronics.

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先进的热管理解决方案及其在高压封装中的集成含义的综述

近年来，出现了许多具有高压功能的电子封装方法，可用于下一代电力电子设备。在本文中，重点是在功率密度超过25 kW / L的这些尖端包装选项中管理热特性的挑战。使用SiC和GaN等宽带隙半导体可以通过使用高频开关拓扑来帮助降低与传导损耗相关的热效率低下，但是即使如此，考虑到移动电气系统对高压的需求，发热仍然是主要的限制因素被广泛采用。因此，功率密度的增加导致设备和封装级的温度高得多，进而降低了此类系统的可靠性，在包装内的热击穿或热机械应变方面。结果，这些电子设备的冷却系统设计已成为成功实施的关键组成部分，有效的热管理方案必须与电子封装紧密集成，以实现最大收益。这篇综述着眼于电子系统中已经展示的各种热管理方法，特别着重于下一代高压电力电子设备的挑战和需求。