High thermal conductivity polymer composites have increased application in modern electronics. To achieve high thermal conductivity at relatively low filler content, two critical approach are used: surface modification of the filler and construction of thermal conductive network in polymer composites. This article provided a new simple and feasible method to modify h-BN consisting of physical absorption of polyvinylpyrrolidone (PVP) and hydrolysis of tetraethyl orthosilicate (TEOS). Then, SiO2@BN/PMMA composites were fabricated via solution-mixing and hot compression. The surface modification of BN enhanced the interface interaction between adjacent BN, which led to reduced thermal resistance and phonon scattering. The solution-mixing and hot compression process ensured the formation of thermal conductive pathway at the same time. The highest thermal conductivity of 40 vol% SiO2@BN/PMMA composite reached 5.583W /m K, which exhibited 3292% and 200% enhancement compared with the pure PMMA and melt-mixing BN/PMMA composites, respectively.

中文翻译：

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二氧化硅包覆氮化硼（SiO2@BN）/聚甲基丙烯酸甲酯（PMMA）复合材料中导热系数的协同增强

高导热聚合物复合材料在现代电子产品中的应用越来越广泛。为了在相对较低的填料含量下实现高导热性，使用了两种关键方法：填料的表面改性和聚合物复合材料中导热网络的构建。本文提供了一种新的简单可行的h-BN改性方法，包括聚乙烯吡咯烷酮(PVP)的物理吸附和原硅酸四乙酯(TEOS)的水解。然后，通过溶液混合和热压缩制备 SiO2@BN/PMMA 复合材料。BN的表面改性增强了相邻BN之间的界面相互作用，从而降低了热阻和声子散射。溶液混合和热压过程同时保证了导热通路的形成。