Abstract Thermal contact resistance (TCR) between the thermal interface materials (TIMs) and the upper and lower contact surfaces plays an important role in the heat dissipation process of electronic devices. Moreover, TCR is mainly affected by temperature, pressure and fluidity of TIMs. When the critical operating temperature of the electronic device is reached, if solid-solid contact between two contact surfaces is changed into solid-liquid contact, TCR will be greatly reduced. Based on this idea, a novel form-stable phase change TIMs is proposed. The thermal conductivity of paraffin wax (PA) is improved by filling Al2O3 particles. The addition of olefin block copolymer (OBC) improves the stability and solves the leakage problem of PA. In addition, the effects of temperature and pressure on the TCR, especially near the phase transition point, are systematically studied. These results confirm that TCR of phase change Al2O3/OBC/PA is very sensitive to temperature. When the temperature rises from 37 °C to 41 °C, TCR of all samples decreases sharply from 10~20 K ⋅ c m 2 / W to 1~2 K ⋅ c m 2 / W . TCR of all samples decreases slowly with the increase of pressure (10~50 Psi, 45 °C) and is very close to the TCR of common thermal grease. Finally, when the mass fraction of Al2O3 is higher than 60 wt%, the thermal conductivity of the Al2O3/OBC/PA increases sharply with the increase of Al2O3. Therefore, form-stable Al2O3/OBC/PA is an important development direction to solve the heat dissipation in electronic technology.

中文翻译：

---

一种新型形状稳定相变热界面材料烯烃嵌段共聚物/石蜡填充 Al2O3 的热性能

摘要 热界面材料（TIM）与上下接触面之间的接触热阻（TCR）在电子器件的散热过程中起着重要作用。此外，TCR主要受TIMs的温度、压力和流动性影响。当达到电子器件的临界工作温度时，如果将两个接触面之间的固-固接触变为固-液接触，TCR将大大降低。基于这个想法，提出了一种新型的形状稳定相变 TIM。石蜡 (PA) 的导热性通过填充 Al2O3 颗粒得到改善。烯烃嵌段共聚物（OBC）的加入提高了稳定性，解决了PA的渗漏问题。此外，温度和压力对 TCR 的影响，尤其是在相变点附近，被系统地研究。这些结果证实相变 Al2O3/OBC/PA 的 TCR 对温度非常敏感。当温度从 37 °C 上升到 41 °C 时，所有样品的 TCR 从 10~20 K ⋅ cm 2 / W 急剧下降到 1~2 K ⋅ cm 2 / W。所有样品的TCR随着压力的增加（10~50 Psi，45°C）缓慢下降，非常接近普通导热硅脂的TCR。最后，当 Al2O3 的质量分数高于 60 wt% 时，Al2O3/OBC/PA 的热导率随着 Al2O3 的增加而急剧增加。因此，形态稳定的Al2O3/OBC/PA是电子技术中解决散热问题的重要发展方向。所有样品的 TCR 从 10~20 K ⋅ cm 2 / W 急剧下降到 1~2 K ⋅ cm 2 / W。所有样品的TCR随着压力的增加（10~50 Psi，45°C）缓慢下降，非常接近普通导热硅脂的TCR。最后，当 Al2O3 的质量分数高于 60 wt% 时，Al2O3/OBC/PA 的热导率随着 Al2O3 的增加而急剧增加。因此，形态稳定的Al2O3/OBC/PA是电子技术中解决散热问题的重要发展方向。所有样品的 TCR 从 10~20 K ⋅ cm 2 / W 急剧下降到 1~2 K ⋅ cm 2 / W。所有样品的TCR随着压力的增加（10~50 Psi，45°C）缓慢下降，非常接近普通导热硅脂的TCR。最后，当 Al2O3 的质量分数高于 60 wt% 时，Al2O3/OBC/PA 的热导率随着 Al2O3 的增加而急剧增加。因此，形态稳定的Al2O3/OBC/PA是电子技术中解决散热问题的重要发展方向。Al2O3/OBC/PA 的热导率随着 Al2O3 的增加而急剧增加。因此，形态稳定的Al2O3/OBC/PA是电子技术中解决散热问题的重要发展方向。Al2O3/OBC/PA 的热导率随着 Al2O3 的增加而急剧增加。因此，形态稳定的Al2O3/OBC/PA是电子技术中解决散热问题的重要发展方向。