当前位置: X-MOL 学术IEEE Microw. Wirel. Compon. Lett. › 论文详情
Ultrawideband Signal Transition Using Quasi-Coaxial Through-Silicon-Via (TSV) for mm-Wave IC Packaging
IEEE Microwave and Wireless Components Letters ( IF 2.374 ) Pub Date : 2020-01-06 , DOI: 10.1109/lmwc.2019.2960884
Jong-Min Yook; Young-Gon Kim; Wansik Kim; Sosu Kim; Jun Chul Kim

In this letter, a quasi-coaxial through-silicon-via (TSV) is presented for millimeter-wave integrated circuit (IC) packaging. The quasi-coaxial-via (Q-COV) structure in which one side ground metal is removed can minimize the interconnect length when it is mounted, in comparison to the coaxial-via (COV) structure. Simulation analysis shows that the Q-COV has similar electrical characteristics as the COV up to 100 GHz even though there is no GND on one side. To make the small signal core of the Q-COV, the silicon-core metallization process was used and a Si-interposer with Q-COVs of 50- $\mu \text{m}$ core diameter was fabricated and mounted on the glass board for signal transition analysis. The measured transition loss in the mounted Si-interposer was very small, only about 0.6 dB at 100 GHz, and the return loss was more than 20 dB for the entire measured frequency band (0–110 GHz).
更新日期:2020-02-14

 

全部期刊列表>>
智控未来
聚焦商业经济政治法律
跟Nature、Science文章学绘图
控制与机器人
招募海内外科研人才,上自然官网
隐藏1h前已浏览文章
课题组网站
新版X-MOL期刊搜索和高级搜索功能介绍
ACS材料视界
x-mol收录
湖南大学化学化工学院刘松
上海有机所
李旸
南方科技大学
西湖大学
伊利诺伊大学香槟分校
徐明华
中山大学化学工程与技术学院
试剂库存
天合科研
down
wechat
bug