A novel behavior model expressing the effect of contact pressure on the passive intermodulation (PIM) performance was proposed and experimentally verified. The finite-element analysis (FEA) model of the central conductor of a typical coaxial connector was developed based on the structural analysis and contact surface modeling. Simulation results identified the current densities in the contact areas. The third-order intermodulation (IM3) power was mathematically predicted by using the nonlinear current truncation distortion model in electrical contact points. Accelerated tests were designed and conducted to produce connector samples with different contact pressures. These samples were measured by a PIM analyzer in a 900-MHz frequency band. Good agreement was obtained between the predictions and the measurements, validating the PIM analysis method and results.

中文翻译：

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同轴连接器中接触压力对无源互调的影响

提出并通过实验验证了一种表达接触压力对无源互调 (PIM) 性能影响的新行为模型。基于结构分析和接触面建模，开发了典型同轴连接器中心导体的有限元分析 (FEA) 模型。模拟结果确定了接触区域中的电流密度。三阶互调 (IM3) 功率通过使用电气接触点中的非线性电流截断失真模型进行数学预测。加速测试被设计和进行以生产具有不同接触压力的连接器样品。这些样本是通过 PIM 分析仪在 900 MHz 频带内测量的。在预测和测量之间获得了很好的一致性，