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A Cross‐Linked Interconnecting Layer Enabling Reliable and Reproducible Solution‐Processing of Organic Tandem Solar Cells
Advanced Energy Materials ( IF 24.4 ) Pub Date : 2020-02-09 , DOI: 10.1002/aenm.201903800
Chao Liu 1, 2 , Xiaoyan Du 1 , Shuai Gao 1 , Andrej Classen 1 , Andres Osvet 1 , Yakun He 1, 2 , Karl Mayrhofer 3 , Ning Li 1, 4, 5 , Christoph J. Brabec 1, 4
Affiliation  

The performance of tandem organic solar cells (OSCs) is directly related to the functionality and reliability of the interconnecting layer (ICL). However, it is a challenge to develop a fully functional ICL for reliable and reproducible fabrication of solution‐processed tandem OSCs with minimized optical and electrical losses, in particular for being compatible with various state‐of‐the‐art photoactive materials. Although various ICLs have been developed to realize tandem OSCs with impressively high performance, their reliability, reproducibility, and generic applicability are rarely analyzed and reported so far, which restricts the progress and widespread adoption of tandem OSCs. In this work, a robust and fully functional ICL is developed by incorporating a hydrolyzed silane crosslinker, (3‐glycidyloxypropyl)trimethoxysilane (GOPS), into poly(3,4‐ethylenedioxythiophene):poly(styrenesulfonate) (PEDOT:PSS), and its functionality for reliable and reproducible fabrication of tandem OSCs based on various photoactive materials is validated. The cross‐linked ICL can successfully protect the bottom active layer against penetration of high boiling point solvents during device fabrication, which widely broadens the solvent selection for processing photoactive materials with high quality and reliability, providing a great opportunity to continuously develop the tandem OSCs towards future large‐scale production and commercialization.

中文翻译:

交叉链接的互连层使有机串联太阳能电池能够可靠且可重复地进行溶液处理

串联有机太阳能电池(OSC)的性能与互连层(ICL)的功能和可靠性直接相关。但是,要开发出一种功能全面的ICL,以可靠且可重现的方式制造溶液加工的串联OSC,同时将光和电损耗降至最低,尤其是要与各种最新的光敏材料兼容,这是一个挑战。尽管已经开发了各种ICL来实现具有令人印象深刻的高性能的串联OSC,但是到目前为止,它们的可靠性,可重复性和通用性很少得到分析和报道,这限制了串联OSC的进展和广泛采用。在这项工作中,通过将水解的硅烷交联剂(3-缩水甘油基氧丙基)三甲氧基硅烷(GOPS)掺入到poly(3,验证了4-乙烯二氧噻吩):聚(苯乙烯磺酸盐)(PEDOT:PSS)及其基于各种光敏材料的串联OSC可靠且可重复生产的功能。交联的ICL可以成功保护底部活性层免受器件制造过程中高沸点溶剂的渗透,从而广泛拓宽了用于加工高质量和高可靠性光敏材料的溶剂选择范围,为继续开发串联OSC向未来的大规模生产和商业化。
更新日期:2020-03-27
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