The present paper gives an overview of surface failures, internal nonconformities and solders joint failures detected by microscopic analysis of electronic assemblies. Optical microscopy (stereomicroscopy) and Fourier-Transform-Infrared (FTIR) microscopy is used for documentation and failure localization on electronic samples surface. For internal observable conditions a metallographic cross-section analysis of the sample is required. The aim of this work is to present some internal and external observable nonconformities which frequently appear in electronic assemblies. In order to detect these nonconformities, optical microscopy, cross section analysis, FTIR-microscopy and scanning electron microscopy with energy dispersive spectrometry (SEM-EDS) were used as analytical techniques.

中文翻译：

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应用微观分析技术进行电子组件故障分析

本文概述了通过电子组件的显微分析检测到的表面故障、内部不合格和焊点故障。光学显微镜（立体显微镜）和傅里叶变换红外 (FTIR) 显微镜用于电子样品表面的文档记录和故障定位。对于内部可观察条件，需要对样品进行金相横截面分析。这项工作的目的是展示一些经常出现在电子组件中的内部和外部可观察到的不合格。为了检测这些不合格品，将光学显微镜、横截面分析、FTIR 显微镜和具有能量色散光谱的扫描电子显微镜 (SEM-EDS) 用作分析技术。