This paper presents an overview of the problem of surface roughness in ultra-scaled Copper (Cu) interconnects. It is seen that surface roughness can severely degrade the electrical and thermal performance of Cu interconnects. This penalty has largely been ignored that has resulted in fairly optimistic models and estimates. It is in this context that this paper and our ongoing work gains significance. The authors make an attempt to present the big picture with reference to interconnect surface roughness and its implications on various design metrics.

中文翻译：

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下一代微系统的能量感知互连设计

本文概述了超尺度铜（Cu）互连中的表面粗糙度问题。可以看出，表面粗糙度会严重降低Cu互连的电性能和热性能。这种惩罚在很大程度上被忽略了，从而产生了相当乐观的模型和估计。正是在这种背景下，本文和我们正在进行的工作才有意义。作者尝试通过参考互连表面粗糙度及其对各种设计指标的影响来展示全局。