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Adsorption of gold(III) from waste rinse water of semiconductor manufacturing industries using Amberlite XAD-7HP resin
Gold Bulletin ( IF 2.1 ) Pub Date : 2010-09-01 , DOI: 10.1007/bf03214987
Nghiem Van Nguyen , Jae-chun Lee , Soo-kyoung Kim , Manis Kumar Jha , Kang-Sup Chung , Jinki Jeong

Advanced hydrometallurgical separation processes are gaining significant importance for the recovery of gold from the aqueous solutions viz. leach liquor of waste electronics, plating material solutions, and waste wash water from electronic industries. In the present investigation, gold adsorption from the waste rinse water of semiconductor manufacturing industries is reported using Amberlite XAD-7HP. For experimental purposes, chloride waste rinse water that contained primarily Au (281 mg/ L) with trace amounts of Cu, Ni, Zn, Sn etc was used. Batch studies were carried out to optimize various process parameters, including contact time, acidity of solution, and resin dosage for the adsorption of gold from the above waste effluent. Adsorption of 92.25% gold was found from the waste solution within a contact time of 30 minutes at an aqueous to resin (A/R) ratio of 25 mL/g and an equilibrium pH of 0.63. In optimal conditions, the loading capacity of resin for gold was observed to be 58.82 mg of gold/g of resin. The gold adsorption phenomena were confirmed by the comparative FT-IR spectroscopic characterization studies of fresh resin and gold loaded resin. Elution tests were carried out for the elution of gold from the gold loaded resin using various ratio mixtures of acetone and 1.0 M HCl. An elution efficiency of 96.96% gold was achieved at an acetone-to-acid ratio of 9. In this condition, gold-enriched solution containing 7,240 mg gold/ L was obtained. The maximum elution of gold was found to be 99.33% using pure acetone in a contact time of 30 minutes. The data obtained will be useful to simulate the continuous gold adsorption process within a column.

中文翻译:

使用 Amberlite XAD-7HP 树脂从半导体制造行业的冲洗废水中吸附金 (III)

先进的湿法冶金分离工艺对于从水溶液中回收金越来越重要,即。废电子浸出液、电镀材料溶液、电子工业废洗涤水。在目前的调查中,报告了使用 Amberlite XAD-7HP 从半导体制造行业的冲洗废水中吸附金。出于实验目的,使用了主要包含 Au (281 mg/L) 和痕量 Cu、Ni、Zn、Sn 等的氯化物废水冲洗水。进行批量研究以优化各种工艺参数,包括接触时间、溶液酸度和从上述废液中吸附金的树脂用量。吸附 92。在 30 分钟的接触时间内,在 25 mL/g 的水与树脂 (A/R) 比和 0.63 的平衡 pH 值下,从废溶液中发现了 25% 的金。在最佳条件下,观察到树脂对金的负载量为 58.82 毫克金/克树脂。通过新鲜树脂和载金树脂的比较 FT-IR 光谱表征研究证实了金吸附现象。使用不同比例的丙酮和 1.0 M HCl 混合物对金从载金树脂中的洗脱进行了洗脱测试。在丙酮酸比为 9 时,金的洗脱效率为 96.96%。在此条件下,获得了含 7,240 mg 金/L 的富金溶液。使用纯丙酮在 30 分钟的接触时间内发现金的最大洗脱率为 99.33%。
更新日期:2010-09-01
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