Polymeric adhesives are of interest in the digital forensics domain. They can be used to perform more or less complex repairs or even to realise advanced man-in-the-middle attacks in order to carry out reverse engineering of secure systems (Heckmann et al., 2017).

The main aim of this paper is to develop a technique that makes polymeric adhesives sensitive to laser decapsulation attacks while decreasing the laser power deposited during ablation. We will first introduce a theoretical part on the properties of laser radiation ablation and discuss the fundamental equations characterising laser-matter interactions.

In the practical part, we vary the absorbance of our target materials (Electrically Conductive Adhesive (ECA)) by adding either dyes or pigments at different concentrations, to evaluate the influence on sensitivity to laser decapping attacks. The addition of dyes or pigments will have an immediate and crucial impact on coefficients of the fundamental equation of heat that make the polymeric glues sensitive to laser decapping attacks.

Finally, to demonstrate the value of this work, a direct example of application is implemented for the micro-repair of broken bonding wires in areas where traditional techniques using the wire-bonder are not applicable or are likely to create additional damage to neighbouring bonding wires. This paper shows how to make conductive bonding, using ECA, with an accuracy of 15 μm.

聚合物粘合剂在数字取证领域中是令人关注的。它们可以用于执行或多或少的复杂维修，甚至可以实现高级中间人攻击，以执行安全系统的逆向工程（Heckmann等，2017）。

本文的主要目的是开发一种技术，该技术可使聚合物胶粘剂对激光解封装攻击敏感，同时降低消融过程中沉积的激光功率。我们将首先介绍有关激光辐射烧蚀特性的理论部分，并讨论表征激光与物质相互作用的基本方程式。

在实际操作中，我们通过添加不同浓度的染料或颜料来改变目标材料（导电胶粘剂（ECA））的吸收率，以评估其对激光开盖攻击的敏感性的影响。染料或颜料的添加将对基本热量方程的系数产生直接且至关重要的影响，该基本热量方程使聚合物胶对激光开盖攻击敏感。

最后，为了证明这项工作的价值，在不适用使用焊线机的传统技术或可能对相邻焊线造成额外损坏的区域中，对折断的焊线进行微修复的一个直接应用示例得以实现。 。本文展示了如何使用ECA以15μm的精度进行导电键合。