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Microstructure and electrical properties of carbon short fiber reinforced copper composites fabricated by electroless deposition followed by powder metallurgy process
Carbon Letters ( IF 5.5 ) Pub Date : 2019-11-06 , DOI: 10.1007/s42823-019-00093-1
Walid M. Daoush , Turki S. Alkhuraiji , Moath A. Khamis , Turki S. Albogmy

Carbon short fibers/copper composites with different carbon short fiber contents up to 15 wt.% as reinforcements are prepared to investigate the influence of the carbon short fiber surface coating on the microstructure, density, and electrical properties of the carbon short fibers/copper composites. The carbon short fibers were surface treated by acid functionalization followed by alkaline treatment before the coating process. It was observed from the results that coated type copper nanoparticles were deposited on the surface of the carbon short fibers. The surface treated carbon short fibers were coated by copper using the electroless deposition technique in the alkaline tartrate bath by using formaldehyde as a reducing agent of the copper sulfate. The produced coated carbon short fibers/copper composite powders were cold compacted at 600 MPa, and then sintered at 875 °C for 2 h under (hydrogen/nitrogen 1:3) atmosphere. A reference copper sample was also prepared by the same method to compare between the properties of pure copper and the carbon short fibers/copper composites. The phase composition, morphology, and microstructure of the prepared carbon short fibers/copper composite powders as well as the corresponding carbon short fibers/copper composites were investigated using X-ray diffraction analysis (XRD) and scanning electron microscope (SEM) equipped with an energy-dispersive spectrometer (EDS), respectively. The density and the electrical resistivity of the sintered composites were measured. It was observed from the results that the density was decreased; however, the electrical resistivity was increased by increasing the carbon short fibers wt.%.

中文翻译:

化学沉积后粉末冶金工艺制备的碳短纤维增强铜复合材料的组织和电性能

制备了不同的碳短纤维含量最高为15 wt。%的碳短纤维/铜复合材料作为增强材料,以研究碳短纤维表面涂层对碳短纤维/铜复合材料的微观结构,密度和电性能的影响。在涂覆过程之前,将碳短纤维通过酸官能化表面处理,然后进行碱处理。从结果观察到,涂覆型铜纳米颗粒沉积在碳短纤维的表面上。通过使用甲醛作为硫酸铜的还原剂,在碱式酒石酸浴中使用无电沉积技术在铜上涂覆经表面处理的碳短纤维。将生产的涂层碳短纤维/铜复合粉末在600 MPa下冷压,然后在(氢气/氮气1:3)气氛下于875°C烧结2小时。还通过相同方法制备了参考铜样品,以比较纯铜和碳短纤维/铜复合材料的性能。使用X射线衍射分析(XRD)和配备了X射线衍射分析仪的扫描电子显微镜(SEM)对制备的碳短纤维/铜复合粉末以及相应的碳短纤维/铜复合物的相组成,形貌和微观结构进行了研究。能量色散光谱仪(EDS)。测量了烧结复合材料的密度和电阻率。从结果可以看出,密度降低了。然而,通过增加碳短纤维的重量%,电阻率增加。
更新日期:2019-11-06
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