The application of sintered calcium phosphate dental inserts in the central part of tooth cavities can reduce amount of embedded dental composite and polymerization shrinkage of final dental fillings. The aim of this study was to analyze comparatively physico‐chemical and mechanical properties of dental inserts and shear bond strength (SBS) between three dissimilar hydroxyapatite‐based dental inserts and different restorative materials, after application of different clinical protocols. Starting from two different hydroxyapatite nano powders and nanostructured stabilized zirconia (YSZ), monophasic two‐step sintered dense HAp inserts (TSSHAp), biphasic single‐step sintered controlled porous inserts (HAp/TCp), and single‐step sintered reinforced HAp/YSZ inserts were processed and characterized. Obvious differences in the microstructure of inserts surface were visualized after etching with 37% phosphoric acid. Fracture toughness of sintered inserts was ranged between 1.01 and 1.85 MPam^1/2 (maximum value in the case of HAp/YSZ), while hardness values were in the range of 3.71–5.22 GPa (maximum value in the case of TSSHAp). Acid etching before application improved SBS between inserts and Maxcem compared to direct cement application. TSSHAp and HAP/TCp inserts showed comparable and relatively high SBS values, certainly higher compared to HAp/YSZ inserts. Slightly higher SBS values were measured in the case of TSSHAp insert group, and the highest mean SBS value of 18.51 MPa was determined between TSSHAp inserts and Filtek Z250_SBU following the “self‐etch” protocol.

中文翻译：

---

作为牙本质替代品的不同烧结磷酸钙牙科插入物：对修复材料的剪切粘合强度。

将烧结磷酸钙牙嵌件应用在牙腔中央部位，可以减少牙复合材料的嵌入量和最终填充物的聚合收缩。本研究的目的是在应用不同的临床方案后，比较三种不同的基于羟基磷灰石的牙嵌件和不同修复材料之间的牙嵌件的物理化学和机械性能以及剪切粘合强度 (SBS)。从两种不同的羟基磷灰石纳米粉末和纳米结构稳定氧化锆 (YSZ)、单相两步烧结致密 HAp 插入物 (TSSHAp)、双相单步烧结受控多孔插入物 (HAp/TCp) 和单步烧结增强 HAp/YSZ 开始插入物被处理和表征。在用 37% 的磷酸蚀刻后，刀片表面的微观结构有明显的差异。烧结刀片的断裂韧性介于 1.01 和 1.85 MPam 之间^1/2（HAp/YSZ 情况下的最大值），而硬度值在 3.71-5.22 GPa 范围内（TSSHAp 情况下的最大值）。与直接应用水泥相比，应用前的酸蚀改善了嵌件和 Maxcem 之间的 SBS。TSSHAp 和 HAP/TCp 插入物显示出相当且相对较高的 SBS 值，与 HAp/YSZ 插入物相比肯定更高。在 TSSHAp 插件组的情况下测量到略高的 SBS 值，并且在遵循“自蚀刻”协议的 TSSHAp 插件和 Filtek Z250_SBU 之间确定了 18.51 MPa 的最高平均 SBS 值。