This study focuses on the influence of helium ion irradiation on the microstructure and retention of tungsten (W) and tungsten-chromium (W-Cr) alloy films. Under helium irradiation with fluence of 1.04 × 10²² He²⁺ / m², blisters are found on the surfaces of both W film and W-Cr alloy film. The size and density of blisters on the surface of W-Cr alloy film are smaller than those of W film. As a result of grain refinement by the addition of 5% chromium, the density of grain boundaries in W-Cr alloy film is higher than that of W film. These grain boundaries trap helium atoms and reduce the effective mobility of helium atoms. Thereby, helium blister formation and helium released amount of W-Cr alloy film have been reduced compared to W film under helium irradiation.

这项研究集中于氦离子辐照对钨（W）和钨铬（W-Cr）合金膜的微观结构和保留率的影响。氦气辐照下通量为1.04×10 ²² He ²⁺ / m ²在W膜和W-Cr合金膜的表面都发现有气泡。W-Cr合金膜表面的气泡的尺寸和密度小于W膜的气泡的尺寸和密度。通过添加5％的铬使晶粒细化的结果是，W-Cr合金膜中的晶界密度高于W膜。这些晶界俘获氦原子并降低了氦原子的有效迁移率。因此，与氦气照射下的W膜相比，减少了W-Cr合金膜的氦起泡形成和氦释放量。