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Metal-Filled Epoxy Composites: Mechanical Properties and Electrical/Thermal Conductivity
Journal of Macromolecular Science Part B-Physics ( IF 1.2 ) Pub Date : 2019-12-09 , DOI: 10.1080/00222348.2019.1695820
A. I. Misiura 1 , Ye. P. Mamunya 2 , M. P. Kulish 1
Affiliation  

The mechanical properties and the electrical and thermal conductivity of composites based on an epoxy polymer (EP) filled with dispersed copper (Cu) and nickel (Ni) were studied. It was shown that the electrical conductivity of the composites demonstrated percolation behavior with the values of the percolation threshold being 9.9 and 4.0 vol.% for the EP-Cu and EP-Ni composites, respectively. Using the Lichtenecker model, the thermal conductivity of the dispersed metal phase in the composites, λf, was estimated as being 35 W/mK for Cu powder and 13 W/mK for Ni powder. It was shown that introduction of the filler in EP led to a decrease in the intensity of the mechanical loss tangent (tan δ) peak that was caused by the existence of an immobilized polymer layer around the filler particles which did not contribute to mechanical losses. Using several models the thickness of this layer, ΔR, was estimated. The concept of an “excluded volume” of the polymer, Vex, i.e. the volume of the immobilized polymer layer, which does not depend on the particle size and is determined solely by the value of the interaction parameter, B, was proposed.



中文翻译:

金属填充的环氧树脂复合材料:机械性能和电/热导率

研究了填充有分散的铜(Cu)和镍(Ni)的基于环氧聚合物(EP)的复合材料的机械性能以及导电率和导热率。结果表明,复合材料的电导率表现出渗滤行为,对于EP-Cu和EP-Ni复合物,渗滤阈值分别为9.9和4.0vol。%。使用Lichtenecker模型中,分散的金属相在复合材料的热导率,λ ˚F对于Cu粉,估计为35W / mK,对于Ni粉,估计为13W / mK。结果表明,在EP中引入填料会导致机械损耗角正切(tanδ)峰的强度降低,这是由于在填料颗粒周围存在固定的聚合物层引起的,而该损耗对机械损耗没有贡献。使用几种模型,可以估算该层的厚度ΔR。提出了聚合物的“排除体积” V ex的概念,即固定的聚合物层的体积,其不取决于颗粒大小,并且仅由相互作用参数B的值确定。

更新日期:2020-01-31
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