We have successfully prepared reduced graphene oxide/polyimide (RGO/PI) composite films by solution blending method and thermal annealing. The effects of contents of graphene oxides (GOs) and different anneal temperatures were mainly investigated. The oxygen-containing groups on GOs’ surface can lead to the formation of hydrogen bonds between GO and PI, which are benefit for GO to disperse in PI uniformly and improve PI properties. The coefficient of thermal expansion decreased drastically from 15.46 μm/(m·°C) to 3.94 μm/(m·°C) within the range of 100–300°C, and the glass transition temperature increased. These improvements can help RGO/PI films resist the high temperature when preparing photoelectric devices and get high-performance flexible photoelectric devices. The elastic modulus of RGO/PI films increased slightly, and tensile strength of RGO/PI films remained the same, while the elongation at break decreased.

中文翻译：

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还原氧化石墨烯/聚酰亚胺复合薄膜的制备及性能

我们通过溶液共混法和热退火成功制备了还原氧化石墨烯/聚酰亚胺（RGO/PI）复合薄膜。主要研究了氧化石墨烯（GO）的含量和不同退火温度的影响。GOs表面的含氧基团可以导致GO和PI之间形成氢键，这有利于GO在PI中均匀分散并改善PI性能。在100-300°C范围内，热膨胀系数从15.46 μm/(m·°C)急剧下降到3.94 μm/(m·°C)，玻璃化转变温度升高。这些改进有助于RGO/PI薄膜在制备光电器件时耐高温，获得高性能柔性光电器件。RGO/PI薄膜的弹性模量略有增加，