Abstract A novel hybrid two-phase cooling system was developed that integrated a mechanically pumped two-phase loop with a capillary-driven two-phase cooling device. The latter cooling mechanism was based on evaporation/boiling from wick structures made by sintering copper particles on the interior surfaces of a copper cold plate. The cold plate provided cooling to two surfaces and each of them included four heaters in series. The novelty of the developed technology was preventing flooding of the evaporator wicks by isolating the evaporation surface from the pumped liquid flow that fed them. This arrangement allowed for a high liquid feed flow rate much greater than would be allowed by a capillary pumped system while maintaining a low thermal resistance at the evaporation surface. Using this approach, the cooling system removed over 850 W with a low pumping power below 1.0 W while using R245fa as the working fluid. The equivalent heat fluxes exceeded 970 W/cm2 over areas less than 0.12 cm2. The measured thermal resistance was as low as 0.09 K-cm2/W. The presented thermal management solution enables an increase in the power of high heat flux electronic devices beyond the state-of-the-art.

中文翻译：

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薄混合毛细管两相冷却系统

摘要 开发了一种新型混合两相冷却系统，该系统将机械泵送的两相回路与毛细管驱动的两相冷却装置集成在一起。后一种冷却机制基于从通过在铜冷板的内表面上烧结铜颗粒制成的灯芯结构的蒸发/沸腾。冷板为两个表面提供冷却，每个表面包括四个串联的加热器。所开发技术的新颖之处在于通过将蒸发表面与供给它们的泵送液体流隔离来防止蒸发器吸液管溢流。这种布置允许比毛细管泵送系统所允许的高得多的液体进料流速，同时在蒸发表面保持低热阻。使用这种方法，当使用 R245fa 作为工作流体时，冷却系统在低于 1.0 W 的低泵功率下去除了 850 W 以上的功率。面积小于 0.12 cm2 的等效热通量超过 970 W/cm2。测得的热阻低至 0.09 K-cm2/W。所提出的热管理解决方案能够将高热通量电子设备的功率提高到最先进的水平。