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Fabrication of three-dimensional connected W-Cu10Sn composites by selective laser melting
Materials Letters ( IF 2.7 ) Pub Date : 2020-04-01 , DOI: 10.1016/j.matlet.2020.127377
Zhenlu Zhou , Zhen Tan , Dingyong He , Zheng Zhou , Li Cui , Yiming Wang , Wei Shao , Guohong Wang

Abstract Three-dimensional connected W-Cu10Sn composites materials with high relative density (99.36%) were fabricated through selective laser melting (SLM). The densification process of the composite balanced the melting of W, evaporation of Cu/Sn and the spreading of melted α-Cu. Under the optimized SLM parameters, high laser power (LP) melted the most of W powder, the adjacent laser scanning track with small hatch space (HS) could fuse W phase together. With small HS and low scanning speed (SS), the spreading of melted α-Cu could fill up the pores caused by the evaporation of Cu/Sn. Finally, a three-dimensional connected structure is formed by W phase, and α-Cu phase occupied the gaps the gaps among W phase.

中文翻译:

激光选区熔化制备三维连接W-Cu10Sn复合材料

摘要 通过选区激光熔化(SLM)制备了具有高相对密度(99.36%)的三维连接W-Cu10Sn复合材料。复合材料的致密化过程平衡了 W 的熔化、Cu/Sn 的蒸发和熔化的 α-Cu 的扩散。在优化的 SLM 参数下,高激光功率 (LP) 熔化了大部分 W 粉,相邻的具有小孵化空间 (HS) 的激光扫描轨道可以将 W 相融合在一起。由于 HS 小,扫描速度 (SS) 低,熔化的 α-Cu 的扩散可以填充由 Cu/Sn 蒸发引起的孔隙。最后,W相形成三维连通结构,α-Cu相占据了W相之间的空隙。
更新日期:2020-04-01
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