Synthesis and Properties of a Silicon‐Containing Arylacetylene Resin with 2,6‐Diphenoxypyridine Unit,ChemistrySelect

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Synthesis and Properties of a Silicon‐Containing Arylacetylene Resin with 2,6‐Diphenoxypyridine Unit
ChemistrySelect ( IF 1.9 ) Pub Date : 2020-01-20 , DOI: 10.1002/slct.201902444
Manping Ma ₁ , Chuan Li ₁ , Xiaotian Liu ₁ , Qiaolong Yuan ₁ , Farong Huang ₁

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A novel silicon‐containing arylacetylene resin called poly(dimethylsilylene‐ethylene‐phenoxypyridyloxy‐phenylene‐ethylene) (PSPPY) was made from 2,6‐bis(4‐ethynyl‐phenoxy) pyridine and dimethyldichlorosilane by Grignard reactions. The structure and properties of the resin were characterized by ¹H‐NMR, FT‐IR, GPC, XRD, DSC, TGA and universal testing machine. The resin has a wide processing window ranged from 35 °C to 155 °C. The cured resin shows excellent mechanical property, low dielectric property and high thermal stability. The flexural strength of the cured resin at room temperature reaches 58.7 MPa. The cured resin has dielectric constant 3.0–3.5, dielectric loss 0.008‐0.040 in the frequency of 10⁻¹‐10⁶ Hz, and low water uptake (0.8 %). The degradation temperature at 5 % weight loss and the residue at 800 °C of the cured resin arrive at 500 °C and 77.1 % in nitrogen atmosphere, respectively.

中文翻译：

含2,6-二苯氧基吡啶单元的含硅芳基乙炔树脂的合成与性能

一种新型的含硅芳基乙炔树脂称为聚（二甲基甲硅烷基-乙烯-苯氧基吡啶氧基-亚苯基-乙烯）（PSPPY）是由2,6-双（4-乙炔基-苯氧基）吡啶和二甲基二氯硅烷通过格氏反应制得的。通过¹ H-NMR，FT-IR，GPC，XRD，DSC，TGA和通用测试仪对树脂的结构和性能进行了表征。该树脂的加工窗口范围从35°C到155°C不等。固化的树脂表现出优异的机械性能，低介电性能和高热稳定性。固化的树脂在室温下的弯曲强度达到58.7MPa。固化的树脂在10 ^-1 -10 ⁶频率下的介电常数为3.0-3.5，介电损耗为0.008-0.040 Hz，低吸水率（0.8％）。在氮气氛下，失重为5％时的降解温度和固化树脂在800°C下的残留量分别为500°C和77.1％。

更新日期：2020-01-21

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