We have fabricated DML/EML-based subassembly modules based on chip-to-chip optical butt-coupling with straight waveguides between a silica AWG chip and commercial directly modulated laser (DML) or electro-absorption modulated laser (EML) chips. By properly inducing external optical feedback on the DML chips, we experimentally demonstrate that 3-dB bandwidths of the DML-based subassembly module can be increased by 5 ~ 9.5 GHz compared with those of commercial 28-Gbaud DML chips. The EML-based subassembly module exhibits optical characteristics insensitive to the external optical reflection with a side mode suppression ratio (SMSR) of over 50 dB, revealing excellent optical eye patterns under 112-Gbps PAM4 operations.

中文翻译：

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使用与基于二氧化硅的 PLC 对接耦合的光源的光学组件模块

我们已经制造了基于 DML/EML 的子组件模块，该模块基于芯片到芯片光学对接耦合，在石英 AWG 芯片和商用直接调制激光器 (DML) 或电吸收调制激光器 (EML) 芯片之间使用直波导。通过在 DML 芯片上适当地引入外部光反馈，我们通过实验证明，与商用 28-Gbaud DML 芯片相比，基于 DML 的子组件模块的 3-dB 带宽可以增加 5~9.5 GHz。基于 EML 的子组件模块表现出对外部光反射不敏感的光学特性，边模抑制比 (SMSR) 超过 50 dB，在 112-Gbps PAM4 操作下显示出出色的光学眼图。