Abstract Graded mesh inserts that spatially enhance the thermal conductivity of phase change materials (PCM) are optimized to minimize the time averaged thermal resistance between the heat source and the melt-front, to improve heat dissipation rates for electronics. Conventionally, the low thermal conductivities of PCM are enhanced by incorporating spatially-homogeneous porous fillers with high thermal conductivities. We investigate the relative advantages of porous fillers that spatially distribute enhancements to thermal conductivity. An arbitrary polynomial form of the spatial variation is optimized based on a numerical solution to the heat diffusion equation, to enhance heat dissipation rates in one-dimensional spherical and cylindrical coordinates. The most desirable spatial distributions are non-linear, have higher thermal conductivity near to the hot-spot, and a positive second derivative with respect to the radial coordinate (i.e. concave-up). We demonstrate enhancements of heat dissipation rates for constant temperature hot-spots, or reductions in temperature for constant power hot-spots, by factors of 900% and 300% in spherical and cylindrical coordinates, relative to those achieved by uniform fillers of equivalent average volume fractions. Recent advances in additive manufacturing make metal meshes with spatially graded volume fraction realizable.

中文翻译：

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通过空间渐变金属网增强相变材料的热点热管理

摘要 在空间上增强相变材料 (PCM) 热导率的渐变网格插入物经过优化，以最小化热源和熔体前沿之间的时间平均热阻，从而提高电子产品的散热率。传统上，PCM 的低热导率是通过加入具有高热导率的空间均匀多孔填料来增强的。我们研究了在空间上分布增强导热性的多孔填料的相对优势。基于热扩散方程的数值解优化空间变化的任意多项式形式，以提高一维球坐标和柱坐标中的散热率。最理想的空间分布是非线性的，在热点附近具有更高的热导率，并且相对于径向坐标具有正的二阶导数（即上凹）。我们证明了恒温热点的散热率提高，或恒定功率热点的温度降低，在球坐标和圆柱坐标中，相对于通过相同平均体积的均匀填料实现的效果，提高了 900% 和 300%分数。增材制造的最新进展使具有空间梯度体积分数的金属网得以实现。相对于通过相同平均体积分数的均匀填料所获得的结果，球坐标和圆柱坐标中的系数分别为 900% 和 300%。增材制造的最新进展使具有空间梯度体积分数的金属网得以实现。相对于通过相同平均体积分数的均匀填料所获得的结果，球坐标和圆柱坐标中的系数分别为 900% 和 300%。增材制造的最新进展使具有空间梯度体积分数的金属网得以实现。