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Alumina film deposited by spin-coating method for silicon wafer surface passivation
Journal of Materials Science: Materials in Electronics ( IF 2.8 ) Pub Date : 2020-01-13 , DOI: 10.1007/s10854-019-02808-6
Liqi Cao , Ning Yang , Shizheng Li , Xiaojun Ye , Xiao Yuan , Hongbo Li , Hua Tong

In the present work, alumina gel was developed for passivating silicon wafers. The alumina gel was prepared by sol–gel method with aluminum sec-butoxide as precursor. After coating, rapid thermal process (RTP) was conducted to activate the passivation effect. X-ray photoelectron spectroscopy and C–V curve were executed to evaluate film properties. The peak at 74.35 eV confirmed the formation of Al2O3. Meanwhile, a small peak at low binding energy decreased with the growth of annealing temperature, which was ascribed to the escape of hydrogen, leading to the decline of effective lifetime after 700 °C. The highest fixed charge (Qf) of − 1.16e12 cm−2 and superior interface defect density at mid gap (Dit) of 1.98e12 cm−2eV−1 were obtained at the annealing temperature of 700 °C, contributing to the highest effective minority carrier lifetime of 292 µs. The present work will be helpful to provide a more cost-effective technique for Al2O3 passivation.

中文翻译:

通过旋涂法沉积的氧化铝膜用于硅晶片表面钝化

在本工作中,开发了用于钝化硅晶片的氧化铝凝胶。氧化铝凝胶是通过溶胶-凝胶法以仲丁醇铝为前体制备的。涂覆后,进行快速热处理(RTP)以激活钝化效果。用X射线光电子能谱和C–V曲线评估膜的性能。74.35 eV处的峰证实了Al 2 O 3的形成。同时,随着退火温度的升高,低结合能下的一个小峰减小,这归因于氢的逸出,导致700℃后的有效寿命下降。最高固定电荷(Q f)为-1.16e12 cm -2,中间隙处的界面缺陷密度更高(D it在700℃的退火温度下获得1.98e12 cm -2 eV -1),从而有助于使最高有效少数载流子寿命达到292 µs。目前的工作将有助于为Al 2 O 3钝化提供更具成本效益的技术。
更新日期:2020-01-13
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