High-performance low-k and low-loss circuit materials are urgently needed in the field of microelectronics due to the upcoming Fifth-Generation Mobile Communications Technology (5G Technology). Herein, a facile design strategy for non-fluorinated intrinsic low-k and low-loss polyimides is reported by fully considering the secondary relaxation behaviors of the polymer chains. A new amorphous non-fluorinated polymer (TmBPPA) with a k value of 2.23 and a loss tangent lower than 3.94 × 10⁻³ at 10⁴ Hz has been designed and synthesized, which to the best of our knowledge is the lowest value amongst the non-fluorinated and non-porous polymers reported in literature. Meanwhile, TmBPPA exhibits excellent overall properties, such as excellent thermostability, good mechanical properties, low moisture absorption, and high bonding strength. As high-performance flexible circuit materials, all these characteristics are highly expected to meet the present and future demands for high density, high speed, and high frequency electronic circuit used in 5G wireless networks.

中文翻译：

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非氟化本征低k和低损耗介电聚合物的一种简便策略：次要松弛行为的有效利用

由于即将推出的第五代移动通信技术（5G技术），在微电子领域迫切需要高性能的低k和低损耗电路材料。本文中，通过充分考虑聚合物链的二次弛豫行为，报道了一种适用于非氟化本征低k和低损耗聚酰亚胺的简便设计策略。一种新型无定形非氟化聚合物（TmBPPA），其k值为2.23，在10 ^4时损耗角正切低于3.94×10 ^-3Hz已经过设计和合成，据我们所知，在文献中报道的非氟化和无孔聚合物中，Hz值最低。同时，TmBPPA具有优异的整体性能，例如出色的热稳定性，良好的机械性能，低吸湿性和高粘结强度。作为高性能柔性电路材料，所有这些特性都有望满足目前和未来对5G无线网络中使用的高密度，高速和高频电子电路的需求。