Transfer printing of electronic functions on arbitrary surfaces is essential for next-generation applications of skin-attachable electronics, wearable sensors, and implantable/medical devices. For transfer printing of electronic functions on multidimensional surfaces, such as curved regions of the skin and different objects, various strategies have been devised based on the materials and structural design of electronic components and transfer stamps, such as ultrathin membranes or in-plane structures of electronic components, soft interfacial glues or adhesives between devices and surfaces, and smart transfer adhesives with bioinspired micro/nanostructures. These techniques enable high conformity of adhesion, mechanical robustness, and high compliance of electronic devices on arbitrary surfaces under mechanical deformation. In this Perspective, we provide an overview of recent transfer printing techniques and discuss their advantages and challenges. In addition, we report a recently developed transfer printing technique based on bioinspired smart adhesives with reversible adhesion, which enables compliant electronics on various arbitrary complex surfaces without performance degradation, providing solutions for various technical challenges remaining in transfer printing. Finally, we present potential applications of transfer printing and future perspectives for this emerging field.

中文翻译：

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在任意复杂表面上转移电子功能的印刷。

电子功能在任意表面上的转印对于皮肤可连接电子设备，可穿戴传感器和可植入/医疗设备的下一代应用至关重要。为了在多维表面（例如皮肤的弯曲区域和不同对象）上进行电子功能的转移打印，已基于电子组件和转移印章（例如超薄膜或薄膜的平面结构）的材料和结构设计，设计了各种策略。电子组件，设备和表面之间的软界面胶或粘合剂，以及具有生物启发性的微/纳米结构的智能转移粘合剂。这些技术使得在机械变形下的任意表面上具有高度的粘附性，机械坚固性以及电子设备的高顺应性。从这个角度来看，我们提供了最新的转印技术的概述，并讨论了它们的优点和挑战。此外，我们报告了最近开发的基于生物启发的具有可逆粘合性的智能粘合剂的转移印刷技术，该技术可使顺应性电子设备在各种任意复杂的表面上均不会性能下降，从而为转移印刷中仍然存在的各种技术挑战提供了解决方案。最后，我们介绍了转移印刷的潜在应用以及该新兴领域的未来前景。它可以在各种任意复杂的表面上实现兼容的电子产品而不会降低性能，从而为转移印刷中仍然存在的各种技术难题提供了解决方案。最后，我们介绍了转移印刷的潜在应用以及该新兴领域的未来前景。它可以在各种任意复杂的表面上实现兼容的电子产品而不会降低性能，从而为转移印刷中仍然存在的各种技术难题提供了解决方案。最后，我们介绍了转移印刷的潜在应用以及该新兴领域的未来前景。