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Surface-Conformal Triboelectric Nanopores via Supramolecular Ternary Polymer Assembly.
ACS Nano ( IF 15.8 ) Pub Date : 2020-01-06 , DOI: 10.1021/acsnano.9b07746 Chanho Park 1 , Min Koo 1 , Giyoung Song 1 , Suk Man Cho 1 , Han Sol Kang 1 , Tae Hyun Park 1 , Eui Hyuk Kim 1 , Cheolmin Park 1
ACS Nano ( IF 15.8 ) Pub Date : 2020-01-06 , DOI: 10.1021/acsnano.9b07746 Chanho Park 1 , Min Koo 1 , Giyoung Song 1 , Suk Man Cho 1 , Han Sol Kang 1 , Tae Hyun Park 1 , Eui Hyuk Kim 1 , Cheolmin Park 1
Affiliation
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A triboelectric nanogenerator (TENG) is of tremendous interest owing to its high energy efficiency with a simple device architecture and applicability to various materials. Most previous topological surface modifications introduced for further improving the performance of a TENG are detrimental because they require expensive and/or harsh (e.g., high temperature and acidity) postetching processes, which limit the material choice and design of its components. Herein, we demonstrate an one-step route for developing rapid wet-processable surface-conformal triboelectric nanoporous films (STENFs). Our method is based on a simple supramolecular assembly of a ternary polymer blend suitable for various conventional solution processes such as spin-, bar-, spray-, and dip-coating. The one-step wet process of a ternary solution produces thin large-area films in which self-assembled, ordered nanopores of approximately 33 nm in diameter are developed even without an additional etching process. The study reveals that the small amount of amine-terminated poly(ethylene oxide) added to the binary blend of sulfonic-acid-terminated poly(styrene) and poly(2-vinylpyridine) efficiently activates the formation of spontaneous nanopores as a pore-generating agent. Our STENF significantly enhances the open-circuit voltage up to 1.5 times higher than that of a planar one, leading to an improved power density of approximately 77 μW/cm2. The suitability for diverse conventional coating processes offers a convenient approach for fabricating high-performance STENFs not only on flat substrates such as metals, polymers, and oxides but also on topological ones including wrinkled, roughened surfaces, textile fibers, natural leaves, and fabrics over a large area.
中文翻译：
通过超分子三元聚合物组装的表面共形摩擦电纳米孔。
摩擦电纳米发电机（TENG）由于其高能效，简单的设备架构以及对各种材料的适用性而备受关注。为进一步提高TENG的性能而引入的大多数先前的拓扑表面修饰都是有害的，因为它们需要昂贵和/或苛刻的（例如高温和酸性）后蚀刻工艺，这限制了材料的选择和组件的设计。在这里，我们演示了开发快速可湿处理的表面保形摩擦电纳米多孔膜（STENFs）的一步法。我们的方法基于三元聚合物共混物的简单超分子组装，适用于各种常规溶液工艺，例如旋涂，棒涂，喷涂和浸涂。三元溶液的一步湿法工艺可产生大面积的薄膜，即使不进行额外的蚀刻工艺，也可以形成直径约33 nm的自组装，有序纳米孔。该研究表明，向磺酸封端的聚苯乙烯和聚2-乙烯基吡啶的二元共混物中加入少量的胺基封端的聚环氧乙烷可有效地激活自发纳米孔的形成，从而产生毛孔。代理商。我们的STENF可以将开路电压显着提高到比平面型开路电压高1.5倍，从而使功率密度提高了约77μW/ cm2。对各种常规涂层工艺的适用性提供了一种便捷的方法，不仅可以在金属，聚合物，
更新日期：2020-01-10
中文翻译：
通过超分子三元聚合物组装的表面共形摩擦电纳米孔。
摩擦电纳米发电机（TENG）由于其高能效，简单的设备架构以及对各种材料的适用性而备受关注。为进一步提高TENG的性能而引入的大多数先前的拓扑表面修饰都是有害的，因为它们需要昂贵和/或苛刻的（例如高温和酸性）后蚀刻工艺，这限制了材料的选择和组件的设计。在这里，我们演示了开发快速可湿处理的表面保形摩擦电纳米多孔膜（STENFs）的一步法。我们的方法基于三元聚合物共混物的简单超分子组装，适用于各种常规溶液工艺，例如旋涂，棒涂，喷涂和浸涂。三元溶液的一步湿法工艺可产生大面积的薄膜，即使不进行额外的蚀刻工艺，也可以形成直径约33 nm的自组装，有序纳米孔。该研究表明，向磺酸封端的聚苯乙烯和聚2-乙烯基吡啶的二元共混物中加入少量的胺基封端的聚环氧乙烷可有效地激活自发纳米孔的形成，从而产生毛孔。代理商。我们的STENF可以将开路电压显着提高到比平面型开路电压高1.5倍，从而使功率密度提高了约77μW/ cm2。对各种常规涂层工艺的适用性提供了一种便捷的方法，不仅可以在金属，聚合物，
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