Journal of the Mechanical Behavior of Biomedical Materials ( IF 3.3 ) Pub Date : 2020-01-07 , DOI: 10.1016/j.jmbbm.2020.103618 Wei Bai 1 , Liming Shu 2 , Ronglei Sun 3 , Jianfeng Xu 3 , Vadim V Silberschmidt 4 , Naohiko Sugita 2
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Analysis
of a mechanism of bone cutting has an important theoretical and practical significance for orthopaedic surgeries. In this study, the mechanism of material removal in orthogonal cutting of cortical bone is investigated. Chip morphology and crack propagation in cortical bone for various cutting directions and depth-of-cut (DOC) levels are analysed, with consideration of microstructural and sub-microstructural features and material anisotropy. Effects of different material properties of osteons, interstitial matrix and cement lines on chip morphology and crack propagation are elucidated for different cutting directions. This study revealed that differences in chip morphology for various DOCs were due to comparable sizes of the osteons, lamellae and DOC. Acquired force signals and recorded high-speed videos revealed the reasons of fluctuations of dynamic components in tests. Meanwhile, a frequency-domain analysis of force signals showed a frequency difference between formation of a bulk fractured chip and small debris for different cutting directions. In addition, SEM images of the top and side surfaces of the machined bone were obtained. Thus, the analysis of the cutting force and surface damage validated the character of chip formation and explained the material-removal mechanism. This study reveals the mechanism of chip formation in the orthogonal cutting of the cortical bone, demonstrating importance of the correlation between the chip morphologies, the depth of cut and the microstructure and sub-microstructure of the cortical bone. For the first time, it assessed the fluctuations of cutting forces, accompanying chip formation, in time and frequency domains. These findings provide fundamental information important for analysis of cutting-induced damage of the bone tissue, optimization of the cutting process and clinical applications of orthopaedic instruments.
中文翻译：
皮质骨正交切割中材料去除的机理。
分析
的机理研究对骨科手术具有重要的理论和实践意义。在这项研究中，研究了在皮质骨的正交切割中材料去除的机理。考虑到微观结构和亚微观结构特征以及材料各向异性，分析了不同切削方向和切削深度（DOC）水平下的切屑形态和裂纹在皮质骨中的传播。阐明了不同切削方向下，骨质，间隙基质和水泥线的不同材料特性对切屑形态和裂纹扩展的影响。这项研究表明，各种DOC的芯片形态差异是由于骨，薄片和DOC的大小可比。获得的力信号和录制的高速视频揭示了测试中动态组件波动的原因。同时，力信号的频域分析表明，在不同的切割方向上，大块碎屑的形成与小碎屑的形成之间存在频率差。另外，获得了机械加工骨骼的顶面和侧面的SEM图像。因此，对切削力和表面损伤的分析验证了切屑形成的特性并解释了材料去除机理。这项研究揭示了在皮质骨的正交切割中切屑形成的机理，证明了切屑形态，切深与皮质骨的微观结构和亚微观结构之间的相关性很重要。首次，它评估了时域和频域中切削力的波动以及伴随切屑的形成。这些发现提供了基本信息，对于分析切割引起的骨组织损伤，优化切割过程以及骨科器械的临床应用具有重要意义。
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