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Nanoscale evolution of stress concentrations and crack morphology in multilayered CrN coating during indentation: Experiment and simulation
Materials & Design ( IF 7.6 ) Pub Date : 2020-03-01 , DOI: 10.1016/j.matdes.2020.108478
Werner Ecker , Jozef Keckes , Martin Krobath , Jakub Zalesak , Rostislav Daniel , Martin Rosenthal , Juraj Todt

Abstract The layered architecture approach allows designing mechanical and fracture properties of hard coatings. The current study investigates the performance of a multilayered CrN coating, consisted of 5 μm CrN sublayers of very similar mechanical properties and microstructure but different residual stress states, during in-situ wedge indentation. A finite element model of the indentation was developed and validated against measurements of the local multiaxial stress fields during indentation, characterized by means of X-ray nanodiffraction analysis with a spatial resolution of 500 nm. By means of numerical fracture mechanics the effect of the multilayered structure on the formation and morphology of mode II cracks is analyzed. The configurational force concept was applied to investigate the crack driving forces and crack extension angles of static cracks in different geometrical arrangements. The simulation results agree well with the experimental findings and reveal a shielding effect preventing an interface-near crack from entering the CrN layer with the higher compressive residual stresses. Furthermore, the possibility to match the numerical results with the locally resolved experiments allowed determining validated material parameters for the deformation and fracture behavior. The work revealed e.g. that a KIIC of around 1 MPa∙m1/2 is an appropriate choice for the investigated CrN coating.

中文翻译:

压痕过程中多层 CrN 涂层中应力集中和裂纹形态的纳米级演变:实验和模拟

摘要 分层结构方法允许设计硬涂层的机械和断裂性能。目前的研究调查了多层 CrN 涂层的性能,该涂层由 5 μm CrN 亚层组成,这些亚层具有非常相似的机械性能和微观结构,但在原位楔形压痕期间具有不同的残余应力状态。开发了压痕的有限元模型,并根据压痕过程中局部多轴应力场的测量结果进行了验证,其特征是通过空间分辨率为 500 nm 的 X 射线纳米衍射分析进行表征。通过数值断裂力学分析了多层结构对II型裂纹形成和形貌的影响。应用构型力概念来研究不同几何排列下静态裂纹的裂纹驱动力和裂纹扩展角。模拟结果与实验结果非常吻合,并揭示了一种屏蔽效应,可防止界面附近裂纹进入具有较高压缩残余应力的 CrN 层。此外,将数值结果与局部解析实验相匹配的可能性允许确定变形和断裂行为的有效材料参数。工作表明,例如,大约 1 MPa∙m1/2 的 KIIC 是所研究的 CrN 涂层的合适选择。模拟结果与实验结果非常吻合,并揭示了一种屏蔽效应,可防止界面附近裂纹进入具有较高压缩残余应力的 CrN 层。此外,将数值结果与局部解析实验相匹配的可能性允许确定变形和断裂行为的有效材料参数。工作表明,例如,大约 1 MPa∙m1/2 的 KIIC 是所研究的 CrN 涂层的合适选择。模拟结果与实验结果非常吻合,并揭示了一种屏蔽效应,可防止界面附近裂纹进入具有较高压缩残余应力的 CrN 层。此外,将数值结果与局部解析实验相匹配的可能性允许确定变形和断裂行为的有效材料参数。工作表明,例如,大约 1 MPa∙m1/2 的 KIIC 是所研究的 CrN 涂层的合适选择。
更新日期:2020-03-01
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