An efficient, simple, robust strategy for the protection of copper in a neutral medium has been developed by the fabrication of electropolymerised film of 2,5-dimercapto-1,3,4-thiadiazole (DMTD) + TiO 2 composite. The electrosynthesised polymeric and composite films were characterised by different spectroscopic methods (FTIR, Raman spectroscopy, XPS, and XRD pattern). Electrochemical impedance spectroscopy and potentiodynamic polarisation studies confirmed the superior corrosion inhibition performance of fabricated composite film on copper in 3.5% NaCl medium. The enhanced protection efficiency of the polymeric composite could be due to the synergism between the organic polymer and inorganic particles. It is also found that the protection efficiency of the DMTD–TiO 2 composite film lasts for more than 24 h. Further, SEM analysis reveals the formation of the protective film of the composite over Cu surface, while EDAX analysis unravels its composition. The study on effect of scan rate on electropolymerisation revealed that the electrodeposition of the polymer is a diffusion-controlled process. Thus, the study suggests that the fabrication of DMTD–TiO 2 composite is an ideal strategy for the protection of copper in a neutral medium.

中文翻译：

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电沉积聚-2,5-二巯基-1,3,4-噻二唑-TiO2复合膜保护铜免受腐蚀

通过制造 2,5-二巯基-1,3,4-噻二唑 (DMTD) + TiO 2 复合材料的电聚合膜，开发了一种有效、简单、稳健的保护中性介质中铜的策略。电合成的聚合物和复合薄膜通过不同的光谱方法（FTIR、拉曼光谱、XPS 和 XRD 模式）进行表征。电化学阻抗谱和动电位极化研究证实，在 3.5% NaCl 介质中，制备的复合膜在铜上具有优异的缓蚀性能。聚合物复合材料的增强保护效率可能是由于有机聚合物和无机颗粒之间的协同作用。还发现DMTD-TiO 2 复合膜的保护效率持续超过24小时。更多，SEM 分析揭示了复合材料在 Cu 表面形成保护膜，而 EDAX 分析揭示了其组成。扫描速率对电聚合影响的研究表明，聚合物的电沉积是一个扩散控制过程。因此，该研究表明，DMTD-TiO 2 复合材料的制造是在中性介质中保护铜的理想策略。