The rapid dissipation of accumulated heat and efficient electromagnetic interference (EMI) shielding attract considerable attention due to the gradual integration and miniaturization of electronic devices. In an attempt to simultaneously overcome these issues, dual‐direction high thermal conductivity (TC) materials with outstanding electrical insulation and EMI shielding performance are urgently demanded. Herein, a tailor‐made sandwich network structure with insulated outer layer and EMI shielding middle layer is constructed by compression molding. The sandwich network structure endows the composite (#AB0.7/AM0.7/AB0.7) with high TC values of 3.051 and 3.365 Wm⁻¹ K⁻¹ at through‐plane and in‐plane directions, respectively, excellent electrical insulation (6.61 × 10¹³ Ω cm, 3.25 kV/mm) and superior EMI shielding performance (>27.68 dB from 8.2 to 12.4 GHz). All these results demonstrate that the prepared composite with tailor‐made sandwich network structure is a promising candidate as ideal thermal management material for electronic devices.

中文翻译：

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双向高导热率聚合物复合材料，具有出色的电绝缘和电磁屏蔽性能

由于电子设备的逐步集成和小型化，累积热量的快速散发和有效的电磁干扰（EMI）屏蔽备受关注。为了同时克服这些问题，迫切需要具有出色电绝缘性和EMI屏蔽性能的双向高导热率（TC）材料。在此，通过压缩成型构建具有绝缘外层和EMI屏蔽中间层的量身定制的三明治网络结构。夹层网络结构赋予复合材料（＃AB0.7 / AM0.7 / AB0.7）在通面和面内方向分别具有3.051和3.365 Wm ^-1 K ^-1的高TC值，出色的电绝缘性（6.61×10 ¹³ Ωcm，3.25 kV / mm）和出色的EMI屏蔽性能（从8.2到12.4 GHz，> 27.68 dB）。所有这些结果表明，制备的具有量身定制的三明治网络结构的复合材料有望成为电子设备理想的热管理材料。