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Going Vertical: The Future of Electronics
IEEE Micro ( IF 2.8 ) Pub Date : 2019-11-07 , DOI: 10.1109/mm.2019.2944053
Vijaykrishnan Narayanan 1
Affiliation  

This special issue provides an overview of the foundational advances enabling 3-D monolithic systems, reports on exciting new advances, and identifies open opportunities and challenges.

中文翻译:

走向垂直:电子的未来

本期特刊概述了支持3-D整体系统的基础技术进展,报告了令人振奋的新技术,并确定了开放的机遇和挑战。
更新日期:2020-01-04
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