A thin-walled copper (Cu)-tin (Sn) alloy cylinder was treated after spinning at 200-400°C for 0.5 h. The characteristics of the alloy microstructure under different temperatures were analyzed through electron back-scattered diffraction. The results were as follows. The grain size at 200-300°C decreases as the heat treatment temperature rises, but the grain size at 400°C increases. At 200-300°C, the microstructure primarily consists of deformed grains. It is found that the main reason for the formation of high-angle grain boundaries (HAGBs) is static recrystallization. For the grain boundary orientation differential, the low-angle sub-grain boundary gradually grows into the HAGB, and multiple annealing twin Σ9 boundaries appear. Grain orientation is generally random at any temperature range. The mechanical property test indicated that, at the upper critical recrystallization temperature of 300°C, the elongation of the Cu-Sn alloy gradually increases, and its yield strength and ultimate tensile strength rapidly decrease.

中文翻译：

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热处理温度对Cu-Sn合金的自旋结构和性能的影响。

在200-400°C旋转0.5小时后，对薄壁铜（Cu）-锡（Sn）合金圆柱体进行了处理。通过电子背散射衍射分析了不同温度下合金的显微组织特征。结果如下。随着热处理温度升高，在200-300℃的晶粒尺寸减小，但是在400℃的晶粒尺寸增大。在200-300°C下，显微组织主要由变形晶粒组成。发现形成高角度晶界（HAGBs）的主要原因是静态再结晶。对于晶界取向微分，低角度亚晶界逐渐长成HAGB，并出现多个退火孪晶Σ9界。在任何温度范围内，晶粒取向通常是随机的。力学性能测试表明，