Abstract The Application of a microwave supported curing process for coatings in the field of electronic industry poses a challenge. Here the implementation of this technology is represented. Within the scope of the investigation special PCB Test Layouts were designed and the polymer curing process examined by the method of dielectric analysis. Furthermore the coupling of microwave radiation with conductive PCB structures was analyzed experimentally by means of special test boards. The formation of standing waves and regular heating distribution along the conductive wires on the PCB could be observed. The experimental results were compared with numerical simulation. In this context the numerical analysis of microwave PCB interaction led to important findings concerning wave propagation on wired PCB. The final valuation demonstrated a substantial similarity between numerical simulations and experimental results.

中文翻译：

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由于涂层材料的微波支持固化过程的印刷电路板的行为

摘要 微波支持的涂层固化工艺在电子工业领域的应用提出了挑战。这里展示了这项技术的实现。在调查范围内，设计了特殊的 PCB 测试布局，并通过介电分析方法检查了聚合物固化过程。此外，微波辐射与导电 PCB 结构的耦合通过特殊测试板进行了实验分析。可以观察到驻波的形成和沿 PCB 导线的规则加热分布。将实验结果与数值模拟进行了比较。在这种情况下，微波 PCB 相互作用的数值分析导致了有关有线 PCB 上波传播的重要发现。