当前位置: X-MOL 学术IEEE Trans. Compon. Packag. Manuf. Technol. › 论文详情
Our official English website, www.x-mol.net, welcomes your feedback! (Note: you will need to create a separate account there.)
Electrical Interconnects Fabricated From Biodegradable Conductive Polymer Composites
IEEE Transactions on Components, Packaging and Manufacturing Technology ( IF 2.3 ) Pub Date : 2019-05-01 , DOI: 10.1109/tcpmt.2019.2905154
Tao Zhang 1 , Melissa Tsang 2 , Lin Du 1 , Minsoo Kim 1 , Mark G Allen 1
Affiliation  

This paper presents the development and characterization of biodegradable electrical interconnects for transient implantable medical devices. The interconnects comprised micropatterned biodegradable conductive polymer composites, which were developed using iron (Fe) microparticles as the conductive filler and polycaprolactone (PCL) as the insulating matrix. The electrical properties of the composites were investigated under various degradation conditions. Electrical percolation was observed at 17% Fe volume fraction, but higher volume fractions exhibited more stable electrical resistivity throughout the time course of physiological degradation. The electrical resistivity of 40%vf Fe-PCL composites increased tenfold in an emulated packaged environment under degradation. Biodegradable electrical interconnects based on 40%vf Fe-PCL composites were successfully micropatterned in daisy-chain structures, illustrating the process compatibility of Fe-PCL composites for interconnect applications. The electrical resistance of the packaged daisy-chain structures exhibited a reasonable increase under degradation. An electrical lifetime of over five days was also achieved. System integration with a commercial humidity sensor and analytical calculations supporting other application scenarios confirmed the feasibility of micropatterned Fe-PCL interconnects for use in implantable electrical systems.

中文翻译:

由可生物降解的导电聚合物复合材料制成的电气互连

本文介绍了用于瞬态可植入医疗设备的可生物降解电互连的开发和特性。互连包括微图案化的可生物降解的导电聚合物复合材料,该复合材料是使用铁(Fe)微粒作为导电填料,而聚己内酯(PCL)作为绝缘基质开发的。在各种降解条件下研究了复合材料的电性能。在17%的Fe体积分数下观察到电渗流,但是较高的体积分数在生理降解的整个时间过程中表现出更稳定的电阻率。在降解条件下的模拟包装环境中,40%vf Fe-PCL复合材料的电阻率增加了十倍。基于40%vf Fe-PCL复合材料的可生物降解的电气互连件已成功在菊花链结构中进行了微图案化,从而说明了Fe-PCL复合材料在互连应用中的工艺兼容性。封装的菊花链结构的电阻在降解下表现出合理的增加。还实现了超过五天的电气寿命。与商用湿度传感器的系统集成以及支持其他应用场景的分析计算,证实了用于植入式电子系统的微图案Fe-PCL互连的可行性。封装的菊花链结构的电阻在降解下表现出合理的增加。还实现了超过五天的电气寿命。与商用湿度传感器的系统集成以及支持其他应用场景的分析计算,证实了在植入式电气系统中使用微图案Fe-PCL互连的可行性。封装的菊花链结构的电阻在降解下表现出合理的增加。还实现了超过五天的电气寿命。与商用湿度传感器的系统集成以及支持其他应用场景的分析计算,证实了在植入式电气系统中使用微图案Fe-PCL互连的可行性。
更新日期:2019-05-01
down
wechat
bug