A systems approach within an integrated computational materials engineering framework was used to design three new low-cost seamless replacement coinage alloys to reduce the raw material cost of the current US coinage alloys. Maintaining compatibility with current coinage materials required matching the currently used alloy properties of yield strength, work-hardening behavior, electrical conductivity, color, corrosion resistance, and wear resistance. In addition, the designed alloys were required to use current production processes. CALPHAD-based models for electrical conductivity and color were developed to integrate into the system design. Three prototype alloys were designed, produced, and characterized. The design process highlighted the trade-off between minimizing the raw material costs and achieving the desired color properties. Characterization of the three prototype alloys showed good agreement with the design goals.

中文翻译：

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低成本造币材料的系统设计方法。

集成计算材料工程框架内的系统方法用于设计三种新型低成本无缝替代造币合金，以降低当前美国造币合金的原材料成本。保持与当前造币材料的相容性需要匹配当前使用的合金特性，如屈服强度，加工硬化行为，电导率，颜色，耐腐蚀性和耐磨性。另外，所设计的合金需要使用当前的生产工艺。开发了基于CALPHAD的电导率和颜色模型，以集成到系统设计中。设计，生产和表征了三种原型合金。设计过程强调了在最大程度降低原材料成本和获得所需色彩特性之间的权衡。