Ti/Fe bimetallic plate was joined by Cu20V filler. Ti/Fe interface was characterized by fine dendrite structures (β-Ti + FeTi) with hardness ranging from 11 to 16 GPa. These fine dendrites were transformed into coarse cellular structures (CuTi2) when approaching Cu20V weld metal (WM). Cu4Ti and V(s,s) phases were dominant in the central of Cu20V WM with hardness ranging from 4 to 11 GPa. Complex phase constitutions were observed at Cu20V/Fe WM interface consisted of Cu4Ti, V(s,s), Cu(s,s), σ-FeV and Fe2Ti phases with hardness ranging from 4 to 18 GPa. A simplified scenario describing how these phases evolution at Cu20V/Fe WM interface was proposed.

中文翻译：

---

Ti/Fe异种接头纳米压痕及微观结构分析

Ti/Fe双金属板用Cu20V填料连接。Ti/Fe 界面的特征是细小的枝晶结构 (β-Ti + FeTi)，硬度范围为 11 到 16 GPa。当接近 Cu20V 焊接金属 (WM) 时，这些细小的枝晶转变为粗大的蜂窝状结构 (CuTi2)。Cu4Ti 和 V(s,s) 相在 Cu20V WM 的中心占主导地位，硬度范围为 4 到 11 GPa。在 Cu20V/Fe WM 界面观察到复杂的相组成，由 Cu4Ti、V(s,s)、Cu(s,s)、σ-FeV 和 Fe2Ti 相组成，硬度范围为 4 到 18 GPa。提出了描述这些相如何在 Cu20V/Fe WM 界面演变的简化方案。