Aluminum nitride (AlN) is a promising material for heat sinks and microelectronic applications because of the advantages of high theoretical thermal conductivity, high mechanical strength, good electrical insulation, low dielectric constant and low thermal expansion coefficient. However, the difficulties in shaping complex-shaped parts with a high thermal conductivity have retarded the wide applications of AlN ceramic. Herein, we design a new binder system containing resin components and adopt the powder injection molding technology to fabricate complex-shaped AlN parts. After the debinding process, the special binder system would produce residual carbon, which could react with Al₂O₃ and result in decreasing oxygen impurity and forming the yttrium-rich aluminates. The yttrium-rich aluminates can accelerate the densification of AlN ceramic and fasten the oxygen on the triangular grain boundary, leaving the clean grain boundary beneficial for high thermal conductivity. The as-prepared AlN parts with complex shape possess a high thermal conductivity of 248 W m⁻¹ K⁻¹.

氮化铝（AlN）具有较高的理论导热率，较高的机械强度，良好的电绝缘性，较低的介电常数和较低的热膨胀系数，因此是用于散热器和微电子应用的有前途的材料。然而，难以成形具有高导热率的复杂形状的部件阻碍了AlN陶瓷的广泛应用。在这里，我们设计了一种包含树脂成分的新型粘合剂体系，并采用粉末注射成型技术来制造复杂形状的AlN零件。经过脱脂处理后，特殊的粘结剂系统会产生残留的碳，这些碳会与Al ₂ O ₃反应并导致减少氧杂质并形成富钇铝酸盐。富含钇的铝酸盐可以加速AlN陶瓷的致密化，并将氧气固定在三角形晶界上，而留下清洁的晶界有利于提高热导率。制备的具有复杂形状的AlN部件具有248 W m ^-1  K ^-1的高导热率。