Abstract Shape memory polymers (SMPs) will come to act an indispensable part in numerous aspects of human activity. However, the low mechanical strengths and thermal conductivities of SMPs have largely restricted their applications. Remarkable improvements in the mechanical properties and thermal conductivities of SMPs via introducing thermal conductivity fillers have been achieved, though the fillers acted as obstructors or promoters for the thermal response speed of SMPs were unclear. In the present study, ternary hybrid polymeric shape memory composites of graphene oxide/carbon nanotube/waterborne epoxy (GO/CNT/WEP) were fabricated, where GO acted as a non-covalent dispersant for CNT in WEP and as a reactive secondary reinforcing agent to improve the mechanical strength and thermal conductivity of WEP. The experimental results showed that GO and CNT were uniformly dispersed and well incorporated into WEP matrix, significantly enhanced the mechanical properties, thermal conductivity and thermal response speed of the GO/CNT/WEP composites. Moreover, the thermal response speed of the shape memory composites was controlled by their thermal conductivity at low filler content, while the storage modulus was the dominant factor for the thermal response speeds of the shape memory composites at filler content higher than 2 wt%.

中文翻译：

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氧化石墨烯-碳纳米管杂化填料对形状记忆环氧树脂复合材料力学性能和热响应速度的影响

摘要 形状记忆聚合物 (SMPs) 将在人类活动的许多方面发挥不可或缺的作用。然而，SMP 的低机械强度和热导率在很大程度上限制了它们的应用。通过引入导热填料，SMPs 的机械性能和热导率得到了显着改善，尽管填料对 SMPs 的热响应速度起到了阻碍或促进作用尚不清楚。在本研究中，制备了氧化石墨烯/碳纳米管/水性环氧树脂 (GO/CNT/WEP) 的三元混合聚合物形状记忆复合材料，其中 GO 作为 WEP 中 CNT 的非共价分散剂和反应性二级增强剂以提高 WEP 的机械强度和导热性。实验结果表明，GO和CNT均匀分散并很好地结合到WEP基体中，显着提高了GO/CNT/WEP复合材料的力学性能、导热系数和热响应速度。此外，形状记忆复合材料的热响应速度受其在低填料含量下的热导率控制，而储能模量是形状记忆复合材料在填料含量高于 2 wt% 时热响应速度的主要因素。