Abstract A general numerical model to predict the thermal shock resistance of porous ceramic sandwich (PCS) structures with temperature-dependent material properties is developed. Knowledge of the temperature distribution and associated thermal stress in PCS panel is determined by the finite element method of coupled thermoelasticity. The present work considers the hot/cold shock induced center/edge cracks and measures the time-varied thermal stress intensity factors at the crack tip area. The roles of crack length, relative density of foam core, thermal shock load and geometric parameters of the PCS structures are examined. Moreover, fracture failure analysis of the whole PCS structures is carried out and crack propagation manners are detected. The thermal shock resistance curves of the structures are provided and the critical thermal shock temperatures are estimated for any selected characteristic materials. Results reveal that the thermal shock resistance of the PCS structures will be dramatically underestimated with the ignorance of temperature-dependent material properties. The analysis model of this paper provides a rapid prediction of thermal shock behavior of PCS structures at arbitrary temperatures.

中文翻译：

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具有温度相关材料特性的多孔陶瓷夹层结构的抗热震性预测

摘要 开发了一种通用数值模型来预测具有温度相关材料特性的多孔陶瓷夹层 (PCS) 结构的抗热震性。PCS 面板中的温度分布和相关热应力的知识由耦合热弹性的有限元方法确定。目前的工作考虑了热/冷冲击引起的中心/边缘裂纹，并测量了裂纹尖端区域随时间变化的热应力强度因子。研究了裂纹长度、泡沫芯的相对密度、热冲击载荷和 PCS 结构的几何参数的作用。此外，对整个PCS结构进行了断裂失效分析，并检测了裂纹扩展方式。提供了结构的抗热震性曲线，并估计了任何选定的特征材料的临界热震温度。结果表明，由于忽视了与温度相关的材料特性，PCS 结构的抗热震性将被大大低估。本文的分析模型可以快速预测 PCS 结构在任意温度下的热冲击行为。